Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment
Jangam, SivaChandra, Bajwa, Adeel Ahmed, Mogera, Umesh, Ambhore, Pranav, Colosimo, Tom, Chylak, Bob, Iyer, Subramanian
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
실리콘 IC를 밀봉하기 위한 구조체 및 방법
DABRAL SANJAY, ZHAI JUN, HU KUNZHONG, RAMACHANDRAN VIDHYA, JANGAM SIVACHANDRA
Year of Publication 12.03.2024
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Year of Publication 12.03.2024
Patent
Reliability Evaluation of Silicon Interconnect Fabric Technology
Thankappan, Kannan K., Bajwa, Adeel, Vaisband, Boris, Jangam, SivaChandra, Iyer, Subramanian S.
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
Published in 2019 IEEE International Reliability Physics Symposium (IRPS) (01.03.2019)
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Conference Proceeding
Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding
Bajwa, Adeel A., Jangam, SivaChandra, Pal, Saptadeep, Marathe, Niteesh, Tingyu Bai, Fukushima, Takafumi, Goorsky, Mark, Iyer, Subramanian S.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Demonstration of a Low Latency (<20 ps) Fine-pitch (≤10 μm) Assembly on the Silicon Interconnect Fabric
Jangam, SivaChandra, Rathore, Uneeb, Nagi, Sumeet, Markovic, Dejan, Iyer, Subramanian S.
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Latency, Bandwidth and Power Benefits of the SuperCHIPS Integration Scheme
Jangam, SivaChandra, Pal, Saptadeep, Bajwa, Adeel, Pamarti, Sudhakar, Gupta, Puneet, Iyer, Subramanian S.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Electrical Characterization of High Performance Fine Pitch Interconnects in Silicon-Interconnect Fabric
Jangam, SivaChandra, Bajwa, Adeel Ahmed, Thankkappan, Kannan K., Kittur, Premsagar, Iyer, Subramanian Srikantes
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Semiconductor Package with Local Interconnect and Chiplet Integration
Zhai, Jun, Dabral, Sanjay, Cao, Zhitao, Hu, Kunzhong, Jangam, SivaChandra
Year of Publication 28.03.2024
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Year of Publication 28.03.2024
Patent
Structure and Method for Sealing a Silicon IC
Zhai, Jun, Dabral, Sanjay, Ramachandran, Vidhya, Hu, Kunzhong, Jangam, SivaChandra
Year of Publication 01.02.2024
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Year of Publication 01.02.2024
Patent
Structure and method for sealing a silicon IC
Zhai, Jun, Dabral, Sanjay, Ramachandran, Vidhya, Hu, Kunzhong, Jangam, SivaChandra
Year of Publication 21.11.2023
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Year of Publication 21.11.2023
Patent
Structure and Method for Sealing a Silicon IC
Zhai, Jun, Dabral, Sanjay, Ramachandran, Vidhya, Hu, Kunzhong, Jangam, SivaChandra
Year of Publication 09.02.2023
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Year of Publication 09.02.2023
Patent