Search Results - "JANG KYUNG WOON" :: K.UTB vyhledávací portál

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Screen printable epoxy/BaTiO₃ embedded capacitor pastes with high dielectric constant for organic substrate applications

by Jang, Kyung-Woon, Paik, Kyung-Wook
Published in Journal of applied polymer science (15.10.2008)

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Journal Article

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Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages

by JANG, Kyung-Woon, PAIK, Kyung-Wook
Published in IEEE transactions on electronics packaging manufacturing (01.04.2009)

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Journal Article

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Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly

by Jang, Kyung-Woon, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.06.2009)

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Journal Article

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Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

by KIM, Il, JANG, Kyung-Woon, SON, Ho-Young, KIM, Jae-Han, PAIK, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)

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Journal Article

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Effects of Thermal Cycling on Material Properties of Nonconductive Pastes (NCPs) and the Relationship Between Material Properties and Warpage Behavior During Thermal Cycling

by Jang, Kyung-Woon, Kim, Hyoung-Joon, Chung, Chang-Kyu, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.09.2008)

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Journal Article

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Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

by Chung, Chang-Kyu, Kwon, Woon-Seong, Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.09.2007)

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Journal Article

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MANUFACTURING METHOD OF DISPLAY PANEL

by JANG KYUNG WOON, LEE CHANG JOON
Year of Publication 26.05.2023

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Patent

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A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

by Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook
Published in Microelectronics and reliability (01.06.2012)

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Journal Article

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LED MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

by MIN SUNG YONG, JANG KYUNG WOON, LEE CHANG JOON
Year of Publication 07.08.2024

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Patent

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DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

by CHUNG CHANG KYU, MIN SUNG YONG, JANG KYUNG WOON, KIM JIN YOUNG
Year of Publication 21.08.2024

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Patent

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A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly

by HanMin Lee, SeYong Lee, Park, JongHo, Chang-kyu Chung, Kyung-Woon Jang, Il Kim, SeongWoo Choi, Kyung-Wook Paik
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)

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Conference Proceeding

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Ultrafast UV-Curable Adhesives for Optical Pick-Ups

by Chung, Chang-Kyu, Jang, Kyung-Woon, Choi, Hyoung Gil, Jang, Jiyoung, Moon, Youngjun, Jeon, Chulho
Published in Journal of electronic materials (01.08.2013)

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Journal Article

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Highly reliable non-conductive adhesives for flip chip CSP applications

by YIM, Myung-Jin, HWANG, Jin-Sang, KWON, Woonseong, KYUNG WOON JANG, PAIK, Kyung-Wook
Published in IEEE transactions on electronics packaging manufacturing (01.04.2003)

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Journal Article