Obtaining of high surface roughness copper deposits by electroless plating technique
Norkus, Eugenijus, Vaškelis, Algirdas, Jačiauskienė, Janė, Stalnionienė, Irena, Stalnionis, Giedrius
Published in Electrochimica acta (25.04.2006)
Published in Electrochimica acta (25.04.2006)
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Journal Article
Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions
Vaškelis, Algirdas, Jačiauskienė, Janė, Stalnionienė, Irena, Norkus, Eugenijus
Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (01.02.2007)
Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (01.02.2007)
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Journal Article
Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions: Equilibrium and kinetics of electrode processes: a special issue dedicated to Boris M. Grafov on the occasion of his 70th birthday
VASKELIS, Algirdas, JACIAUSKIENE, Jane, STALNIONIENE, Irena, NORKUS, Eugenijus
Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (2007)
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Published in Journal of electroanalytical chemistry (Lausanne, Switzerland) (2007)
Journal Article
PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER
JACIAUSKIENE, Jane, JAGMINIENE, Aldona, VASKELIS, Algirdas, NORKUS, Eugenijus
Year of Publication 10.01.2018
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Year of Publication 10.01.2018
Patent
PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER
NORKUS, EUGENIJUS, JACIAUSKIENE, JANE, JAGMINIENE, ALDONA, VASKELIS, ALGIRDAS
Year of Publication 27.05.2015
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Year of Publication 27.05.2015
Patent
PLATING SOLUTION FOR ELECTROLESS DEPOSITION OF COPPER
NORKUS, EUGENIJUS, JACIAUSKIENE, JANE, JAGMINIENE, ALDONA, VASKELIS, ALGIRDAS
Year of Publication 30.09.2011
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Year of Publication 30.09.2011
Patent
PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF COPPER
DORDI, YEZDI, NORKUS, EUGENIJUS, JACIAUSKIENE, JANE, JAGMINIENE, ALDONA, THIE, WILLIAM, VASKELIS, ALGIRDAS
Year of Publication 31.01.2013
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Year of Publication 31.01.2013
Patent