Novel Detachable & Flippable Probing Stage for Lock-in Thermography and Laser-based Fault Isolation Tool
Izlan, M. A. A, Zamri, M. S. Muhamad, Ooi, Y. K, Ng, C. Y., Ng, J. C.
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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