Imaginary impedance due to hopping phenomena and evaluation of dopant ionization time in cryogenic metal-oxide-semiconductor devices on highly doped substrate
Miyao, Tomohisa, Yoshinaga, Keito, Tanaka, Takahisa, Ishikuro, Hiroki, Tada, Munehiro, Uchida, Ken
Published in Applied physics express (01.05.2024)
Published in Applied physics express (01.05.2024)
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Journal Article
Cryogenic operation of NanoBridge at 4 K for controlling qubit
Okamoto, Koichiro, Tanaka, Takahisa, Miyamura, Makoto, Ishikuro, Hiroki, Uchida, Ken, Sakamoto, Toshitsugu, Tada, Munehiro
Published in Japanese Journal of Applied Physics (01.05.2022)
Published in Japanese Journal of Applied Physics (01.05.2022)
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Journal Article
Low-Power and ppm-Level Multimolecule Detection by Integration of Self-Heated Metal Nanosheet Sensors
Tanaka, Takahisa, Yanagida, Takeshi, Uchida, Ken, Tabuchi, Kenta, Tatehora, Kohei, Shiiki, Yohsuke, Nakagawa, Shuya, Takahashi, Tsunaki, Shimizu, Ryota, Ishikuro, Hiroki, Kuroda, Tadahiro
Published in IEEE transactions on electron devices (01.12.2019)
Published in IEEE transactions on electron devices (01.12.2019)
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Journal Article
A 65nm Cryogenic CMOS Design and Performance at 4.2K for Quantum State Controller Application
Tada, Munehiro, Okamoto, Koichiro, Tanaka, Takahisa, Miyamura, Makoto, Ishikuro, Hiroki, Uchida, Ken, Sakamoto, Toshitsugu
Published in IEEE journal of the Electron Devices Society (01.01.2024)
Published in IEEE journal of the Electron Devices Society (01.01.2024)
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Journal Article
Digital Amplifier: A Power-Efficient and Process-Scaling Amplifier for Switched Capacitor Circuits
Yoshioka, Kentaro, Itakura, Tetsuro, Sugimoto, Tomohiko, Waki, Naoya, Kim, Sinnyoung, Kurose, Daisuke, Ishii, Hirotomo, Furuta, Masanori, Sai, Akihide, Ishikuro, Hiroki
Published in IEEE transactions on very large scale integration (VLSI) systems (01.11.2019)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.11.2019)
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Journal Article
Construction of transgenic Ipomoea obscura that exhibits new reddish leaf and flower colors due to introduction of β-carotene ketolase and hydroxylase genes
Otani, Motoyasu, Kitayama, Kosuke, Ishikuro, Hiroki, Hattan, Jun-ichiro, Maoka, Takashi, Harada, Hisashi, Shiotani, Yuko, Eguchi, Akane, Nitasaka, Eiji, Misawa, Norihiko
Published in Plant Biotechnology (25.06.2021)
Published in Plant Biotechnology (25.06.2021)
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Journal Article
Impact of Lateral SnO2 Nanofilm Channel Geometry on a 1024 Crossbar Chemical Sensor Array
Honda, Haruka, Takahashi, Tsunaki, Shiiki, Yohsuke, Zeng, Hao, Nakamura, Kentaro, Nagata, Shintaro, Hosomi, Takuro, Tanaka, Wataru, Zhang, Guozhu, Kanai, Masaki, Nagashima, Kazuki, Ishikuro, Hiroki, Yanagida, Takeshi
Published in ACS sensors (25.02.2022)
Published in ACS sensors (25.02.2022)
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Journal Article
A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler
Kosuge, Atsutake, Mizuhara, Wataru, Shidei, Tsunaaki, Takeya, Tsutomu, Miura, Noriyuki, Taguchi, Masao, Ishikuro, Hiroki, Kuroda, Tadahiro
Published in IEEE journal of solid-state circuits (01.01.2014)
Published in IEEE journal of solid-state circuits (01.01.2014)
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Journal Article
47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking
Saito, Mitsuko, Yoshida, Yoichi, Miura, Noriyuki, Ishikuro, Hiroki, Kuroda, Tadahiro
Published in IEEE transactions on circuits and systems. I, Regular papers (01.09.2010)
Published in IEEE transactions on circuits and systems. I, Regular papers (01.09.2010)
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Journal Article
Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration
Niitsu, Kiichi, Sugimori, Yasufumi, Kohama, Yoshinori, Osada, Kenichi, Irie, Naohiko, Ishikuro, Hiroki, Kuroda, Tadahiro
Published in IEEE transactions on very large scale integration (VLSI) systems (01.10.2011)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.10.2011)
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Journal Article
A 65fJ/b Inter-Chip Inductive-Coupling Data Transceivers Using Charge-Recycling Technique for Low-Power Inter-Chip Communication in 3-D System Integration
Niitsu, K., Kawai, S., Miura, N., Ishikuro, H., Kuroda, T.
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2012)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2012)
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Journal Article
Modeling and Experimental Verification of Misalignment Tolerance in Inductive-Coupling Inter-Chip Link for Low-Power 3-D System Integration
Niitsu, Kiichi, Kohama, Yoshinori, Sugimori, Yasufumi, Kasuga, Kazutaka, Osada, Kenichi, Irie, Naohiko, Ishikuro, Hiroki, Kuroda, Tadahiro
Published in IEEE transactions on very large scale integration (VLSI) systems (01.08.2010)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.08.2010)
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Journal Article
A 13.56-MHz Wireless Power Transfer System With Enhanced Load-Transient Response and Efficiency by Fully Integrated Wireless Constant-Idle-Time Control for Biomedical Implants
Huang, Cheng, Kawajiri, Toru, Ishikuro, Hiroki
Published in IEEE journal of solid-state circuits (01.02.2018)
Published in IEEE journal of solid-state circuits (01.02.2018)
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Journal Article
Design of Dual Lower Bound Hysteresis Control in Switched-Capacitor DC-DC Converter for Optimum Efficiency and Transient Speed in Wide Loading Range for IoT Application
Tan, Yi, Huang, Cheng, Ishikuro, Hiroki
Published in IEEE journal of solid-state circuits (01.06.2024)
Published in IEEE journal of solid-state circuits (01.06.2024)
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