Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis
Yong Liu, Irving, S., Timwah Luk
Published in IEEE transactions on electronics packaging manufacturing (01.01.2008)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2008)
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Journal Article
3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
Liu, Yong, Liang, Lihua, Irving, Scott, Luk, Timwah
Published in Microelectronics and reliability (01.06.2008)
Published in Microelectronics and reliability (01.06.2008)
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Journal Article
3D Modeling of electromigration combined with thermal-mechanical effect for IC device and package : Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2007)
YONG LIU, LIHUA LIANG, IRVING, Scott, LUK, Timwah
Published in Microelectronics and reliability (2008)
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Published in Microelectronics and reliability (2008)
Journal Article
Trends of Power Electronic Packaging and Modeling
Yong Liu, Irving, S., Luk, T., Kinzer, D.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Parameter Modeling for Wafer Probe Test
Yong Liu, Luk, T., Irving, S.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2009)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2009)
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Journal Article
COMBINATION DEPTHSINK INSTRUMENT
IRVING, Scott Mitchell, ERICKSON, Nathan William, BRANTHOVER, Lewis Pearce, CHRISTENSEN, Zachary Charles
Year of Publication 16.03.2023
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Year of Publication 16.03.2023
Patent