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Presence of έ and ε crystal structures in rapidly solidified intermetallic compound Ni5Ge3
Haque, Nafisul, Jegede, Oluwatoyin Enitan, Mullis, Andrew M.
Published in Journal of alloys and compounds (20.12.2021)
Published in Journal of alloys and compounds (20.12.2021)
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Journal Article
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test
Apalowo, Rilwan Kayode, Abas, Mohamad Aizat, Che Ani, Fakhrozi, Muhamed Mukhtar, Muhamed Abdul Fatah, Ramli, Mohamad Riduwan
Published in Soldering & surface mount technology (15.05.2024)
Published in Soldering & surface mount technology (15.05.2024)
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Journal Article
Effect of laser welding strategy for reducing intermetallic compound formation and residual stress
Chen, Liwei, Okawara, Ryo, Matsuda, Kazuya, Nakao, Masayuki, Nagato, Keisuke
Published in Precision engineering (01.06.2024)
Published in Precision engineering (01.06.2024)
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Journal Article
First-principles study of Al2Sm intermetallic compound on structural, mechanical properties and electronic structure
Lin, Jingwu, Wang, Lei, Hu, Zhi, Li, Xiao, Yan, Hong
Published in Solid state communications (01.02.2017)
Published in Solid state communications (01.02.2017)
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Journal Article
The Effect of Sn Orientation on Intermetallic Compound Growth in Idealized Sn-Cu-Ag Interconnects
Kinney, Chris, Linares, Xioranny, Lee, Kyu-Oh, Morris, J.W.
Published in Journal of electronic materials (01.04.2013)
Published in Journal of electronic materials (01.04.2013)
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Journal Article
Regulating the crystal structure of layered double hydroxide-derived Co-In catalysts for highly selective CO2 hydrogenation to methanol
Zhang, Heng, Mao, Donglei, Zhang, Jinxin, Wu, Dongfang
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.01.2023)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.01.2023)
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Journal Article
Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging
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Journal Article
Conference Proceeding
XPS Study of the Oxidation Behavior of the Cu3Sn Intermetallic Compound at Low Temperatures
Wang, DongNing, Miller, Alfred C., Notis, Michael R.
Published in Surface and interface analysis (01.02.1996)
Published in Surface and interface analysis (01.02.1996)
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Journal Article
Conference Proceeding
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.10.2008)
Published in Journal of electronic materials (01.10.2008)
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Journal Article
Laser roll welding of dissimilar metal joint of zinc coated steel to aluminum alloy
Ozaki, Hitoshi, Kutsuna, Muneharu, Nakagawa, Shigeyuki, Miyamoto, Kenji
Published in Journal of Laser Applications (01.02.2010)
Published in Journal of Laser Applications (01.02.2010)
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Journal Article