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Creative adaptation of interconnect technology across industry boundaries
Jenkins, Dave, Miller, Richard, Desjardin, Greg
Published in Oceans 2015 : MTS/IEEE Washington : 19-22 October 2015 (01.10.2015)
Published in Oceans 2015 : MTS/IEEE Washington : 19-22 October 2015 (01.10.2015)
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Conference Proceeding
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TSV backside processing using copper damascene interconnect technology
Year of Publication 18.06.2013
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Patent
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Influence of IMC surface geometry and material properties on micro-bump reliability of 3D Chip-on-Chip interconnect technology
Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu, Wen-Hwa Chen
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
Published in 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2011)
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Conference Proceeding
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TSV Backside Processing Using Copper Damascene Interconnect Technology
Year of Publication 02.11.2011
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Patent
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Reliability Modelling for Different Wire Bonding Technologies based on FEA and Nano-Indentation
Dudek, Rainer, Mathew, Anu, Albrecht, Jan, Scherf, Christina, Rzepka, Sven, Subbiah, Nilavazhagan, Wilde, Jurgen
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
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TaN thin film study for Superconducting BEOL integration
Segaud, R., Chene, T., Gergaud, P., Minoret, S., Gustavo, F., Garrione, J., Royer, A., Nemouchi, F.
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2023)
Published in Proceedings of the IEEE International Interconnect Technology Conference (01.05.2023)
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Conference Proceeding
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Alternative Metals for Advanced Interconnects: Cobalt and Beyond
Rigsby, Matthew A., Spurlin, Tighe A., Reid, Jonathan D.
Published in Meeting abstracts (Electrochemical Society) (30.05.2021)
Published in Meeting abstracts (Electrochemical Society) (30.05.2021)
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Journal Article