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Experimental Analysis of Server Fan Control Strategies for Improved Data Center Air-based Thermal Management
Sarkinen, Jeffrey, Brannvall, Rickard, Gustafsson, Jonas, Summers, Jon
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
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Determination of Anand constants for SAC solders using stress-strain or creep data
Motalab, M., Cai, Z., Suhling, J. C., Lall, P.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding
Harris, John, Huitink, David
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (28.05.2024)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (28.05.2024)
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Detection of Cooling Operational Statuses in Data Center Energy Management using Clustering Algorithms
Milic, Vlatko, Andersson, Maria, Kage, Linus, Thollander, Patrik, Enkel, Jim, Moshfegh, Bahram
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Thermal conductivity of graphene and graphene oxide nanoplatelets
Mahanta, N. K., Abramson, A. R.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits
Erp, Remco van, Kampitsis, Georgios, Nela, Luca, Ardebili, Reza Soleimanzadeh, Matioli, Elison
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
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Study on evaluation of durability of through-hole solder joints
Kon, Masahiro, Yu, Qiang, Tsuyuki, Tomohiro
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
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Study on Boiling Cooling Characteristics of Immersion Cooling Motors
Hotta, Kohei, Aoyama, Hirotsugu, Yu, Qiang, Fukuda, Aoi, Matsuda, Kazutoshi
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
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Experimental Investigation of Heat Transfer to a Dual Jet Flow with Varying Velocity Ratio
Murphy, Paula J., Alimohammadi, Sajad, O'Shaughnessy, Seamus M.
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (30.05.2023)
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Maximizing the Performance of a 3D Printed Heat Sink by Accounting for Anisotropic Thermal Conductivity During Filament Deposition
Smith, Matthew, Kim, Seokpum, Lambert, Alexander, Walde, Maxwell, Lindahl, John, Mungale, Kaustubh, Bougher, Thomas, Hassen, Ahmed Arabi, Kunc, Vlastimil
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.05.2019)
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Welcome Letter
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
(30.05.2023)
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Conference Proceeding
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Evaluation of Lifetime of Through-Hole Solder Joints Considering Mounting Process and Variation
Tsuyuki, Tomohiro, Yu, Qiang, Ohno, Yuki, Takikawa, Akihiro, Fukasu, Hisataka, Shio, Koji
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
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Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
Kohara, Sayuri, Aoki, Toyohiro, Marushima, Chinami, Taylor, Christine, Sueoka, Kuniaki, Hisada, Takashi
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
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A Benchmark Study on the Thermal Performance and Life of Different Structures of SiC Chip Modules
Hiraoka, Gakuto, Yoshikawa, Ryotaro, Ito, Yuta, Yu, Qiang, Komatsu, Yuji, Chiron, Thomas, Schon, Wolfgang
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
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Evaluation of High cycle fatigue life of solder joint in Si power module
Hashimoto, Yuta, Nakayama, Shingo, Yu, Qiang
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
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Development and Validation of Resistance-Capacitance Model for Phase Change Material Embedded in Porous Media
Alam, Tanjebul, Bacellar, Daniel, Ling, Jiazhen, Aute, Vikrant
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (31.05.2022)
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Journal Article
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Evaluation of Drainage Phase Diagram for PEM Fuel Cell Porous Layer
Arden, Cory W., Connors, Joseph E., Shannon, Rebecca C., Chauhan, Vedang, Santamaria, Anthony D., Heidari, Mahbod, Medici, Ezequiel, Mortazavi, Mehdi
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2021)
Published in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.06.2021)
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Artificial Neural Network Based Prediction of Control Strategies for Multiple Air-Cooling Units in a Raised-floor Data Center
Simon, Vibin Shalom, Siddarth, Ashwin, Agonafer, Dereje
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
Published in I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems (01.07.2020)
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Conference Proceeding