Si-Si 表面活性化接合における活性化条件と表面状態との関係
稲村, 美希, 吉田, 紀子, 小田, 知弘, 阿部, 智之, 阿部, 英之, 楠, 勲
Published in Journal of the Vacuum Society of Japan (2009)
Published in Journal of the Vacuum Society of Japan (2009)
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Journal Article
Vacuum sealing using surface activation bonding of Si wafer
Inamura, Miki, Yoshida, Noriko, Oda, Tomohiro, Abe, Tomoyuki, Abe, Hideyuki, Kusunoki, Isao
Published in Vacuum (10.12.2009)
Published in Vacuum (10.12.2009)
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UV Assisted Chip-on-Wafer Direct Transfer Bonding (CoW DTB)
Kurita, Yoichiro, Warabi, Kaori, Uemura, Hiroshi, Furuyama, Hideto, Ohira, Kazuya, Kakumoto, Yasuhide, Abe, Tomoyuki, Inamura, Miki
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Thin Film Optical Characteristics of InP/Si Hybrid Wafers by Chip-on-Wafer Direct Transfer Bonding Technology
Nishiyama, Nobuhiko, Ohira, Kazuya, Bai, Liu, Kurita, Yoichiro, Furuyama, Hideto, Inamura, Miki, Abe, Tomoyuki, Mitarai, Takuya, Morita, Kenji, Arai, Shigehisa
Published in 2019 Compound Semiconductor Week (CSW) (01.05.2019)
Published in 2019 Compound Semiconductor Week (CSW) (01.05.2019)
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Conference Proceeding
A novel III-V/Si Chip-on-Wafer Direct Transfer Bonding technology
Kurita, Yoichiro, Inamura, Miki, Kakumoto, Yasuhide, Yamada, Yasuhisa, Abe, Tomoyuki
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
III-V/Si Chip-on-Wafer Direct Transfer Bonding technology (CoW DTB); process capabilities and bonded structure characterizations
Kurita, Yoichiro, Uemura, Hiroshi, Ishibashi, Fumitaka, Furuyama, Hideto, Inamura, Miki, Kakumoto, Yasuhide, Abe, Tomoyuki
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Thinkorama
Clayfield, Marion, Smith, Maggie, Doherty, Gary, Marguc, Petra, Bunschoten, Raoul, Reed, Annalise, Fox, Michael, Watson, Victoria, Teatum, Tom, noodleJam, Wilson, David, Inamura, Miki, Lawrence, David, Whitaker, Amy
Published in Architectural design (01.03.2005)
Published in Architectural design (01.03.2005)
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Journal Article
Thinkorama
Clayfield, Marion, Doherty, Gary, Marguc, Petra, Smith, Maggie, Bunschoten, Raoul, Reed, Annalise, Fox, Michael, Teatum, Tom, Watson, Victoria, Wilson, David, Inamura, Miki, Lawrence, David, Whitaker, Amy
Published in Architectural design (01.03.2005)
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Published in Architectural design (01.03.2005)
Journal Article