Heterogeneous Multicore SoC With SiP for Secure Multimedia Applications
Kondo, H., Otani, S., Nakajima, M., Yamamoto, O., Masui, N., Okumura, N., Sakugawa, M., Kitao, M., Ishimi, K., Sato, M., Fukuzawa, F., Imasu, S., Kinoshita, N., Ota, Y., Arimoto, K., Shimizu, T.
Published in IEEE journal of solid-state circuits (01.08.2009)
Published in IEEE journal of solid-state circuits (01.08.2009)
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Journal Article
Heterogeneous Multicore SoC With SiP for Secure Multimedia Applications: SPECIAL ISSUE ON THE 2008 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE
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Published in IEEE journal of solid-state circuits (2009)
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Published in IEEE journal of solid-state circuits (2009)
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Year of Publication 02.03.2021
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Year of Publication 02.03.2021
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MULTI-CHIP-MODULEMCM TYPE SEMICONDUCTOR DEVICE
IMASU SATOSHI, NAKA YASUHIRO, NAITO TAKAHIRO, TANAKA NAOTAKA, YOSHIDA IKUO
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Year of Publication 19.10.2002
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SEMICONDUCTOR DEVICE
IMASU SATOSHI, NAKA YASUHIRO, NAITO TAKAHIRO, TANAKA NAOTAKA, YOSHIDA IKUO
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Year of Publication 14.09.2002
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ACOUSTIC WAVE RESONATOR, FILTER, AND MULTIPLEXER
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Year of Publication 01.11.2018
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Year of Publication 01.11.2018
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AN ELECTRONIC DEVICE AND A METHOD OF MANUFACTURING THE SAME
KADO YOSHIYUKI, IMASU SATOSHI, TAGUCHI KAZUYUKI, NAITO TAKAHIRO, KISHIKAWA NORIO, YOSHIDA IKUO, SATO TOSHIHIKO
Year of Publication 08.03.2002
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Year of Publication 08.03.2002
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High density and reliable packaging technology with Non Conductive Film for 3D/TSV
Mori, Kentaro, Ono, Yoshihiro, Watanabe, Shinji, Ishikawa, Toshikazu, Sugiyama, Michiaki, Imasu, Satoshi, Ochiai, Toshihiko, Mori, Ryo, Kida, Tsuyoshi, Hashimoto, Tomoaki, Tanaka, Hideki, Kimura, Michitaka
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Method of manufacturing a semiconductor device
Sugimura, Takahiro, Imasu, Satoshi, Sugita, Norihiko, Betsui, Takafumi
Year of Publication 24.01.2012
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Year of Publication 24.01.2012
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