Improvement of the adhesion to polyimide substrates of copper films prepared by an ion beam and vapor deposition (IVD) method
Ebe, Akinori, Takahashi, Eiji, Iwamoto, Yasushi, Kuratani, Naoto, Nishiyama, Satoshi, Imai, Osamu, Ogata, Kiyoshi, Setsuhara, Yuichi, Miyake, Shoji
Published in Thin solid films (01.08.1996)
Published in Thin solid films (01.08.1996)
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