Thermal Modeling and Optimization of Mobile Device using modified LPV ROM
Im, Yunhyeok, Jung, Gyuick, Lee, Myunghoon, Gangrade, Akashdeep, Kim, Seungjoo
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Development of Junction Temperature Decision (JTD) Map for Thermal Design of Nano-scale Devices Considering Leakage Power
Yunhyeok Im, Eun Seok Cho, Kiwon Choi, Sayoon Kang
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
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Conference Proceeding
Pattern Continuity Check Approach to Model Effective Thermal Conductivity of PCB
Cho, Youngsang, Hyun, Younghoon, Im, Yunhyeok, Shin, Youngmin
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Thermal Aware Floorplan Optimization of SoC in Mobile Phone
Cho, Youngsang, Kim, Heonwoo, Lee, Kyoungmin, Im, Yunhyeok, Lee, Heeseok, Kim, Minkyu
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Thermal-Aware Optimization of SoC Floorplan with Heterogenous Multi-Cores
Yoo, Jongkyu, An, Taekeun, Oh, Chigwan, Cho, Youngsang, Lee, Heeseok, Im, Yunhyeok, Kim, Minkyu, Kim, Minsu
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Thermal perspective design Analysis of 3D stacked chip integrated by TSV, Micro-bump and TMV with SOC
Cho, Youngsang, Lee, Kyoungmin, Hwang, Kyojin, Lee, Heeseok, Im, Yunhyeok, Kim, Minkyu
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Flower-Like CuO Nanostructures for Enhanced Boiling
Im, Yunhyeok, Dietz, Carter, Lee, Seung S., Joshi, Yogendra
Published in Nanoscale and microscale thermophysical engineering (01.07.2012)
Published in Nanoscale and microscale thermophysical engineering (01.07.2012)
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Journal Article
Equivalent thermal conductivity of a composite structure considering heat spreading on neighboring layers
Hyun, Younghoon, Lee, Bruce Weon, Wook Jung, Ki, Cho, Byeong Yeon, Im, Yunhyeok, Oh, Dan Kyung Suk
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Methodology for Accurate Hotspot Prediction by Upscale Spatiotemporal Resolution of Temperature Sensing using a Power Meter and Resistor-Capacitor Thermal Model
An, Taekeun, Im, Yunhyeok, Yoo, Jongkyu, Cho, Youngsang, Lee, Heeseok, Heo, Yun
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Optimization of hotspot location on multi stacked board of mobile phone
Cho, Youngsang, Yoo, Jongkyu, Im, Yunhyeok, An, Taekeun, Lee, Heeseok, Heo, Yun
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Finding the minimum quantity and the optimum placement of on-die temperature sensor in SOC design based on rank analysis
Lee, Heeseok, Im, Yunhyeok, An, Taekeun, Cho, Young-Sang, Yoo, Jongkyu
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Thermal Model Simplification of Mobile Device with Adaptive Metamodel of Optimal Prognosis (AMOP)
Im, Yunhyeok, Jo, Hyungyung, Oh, Chigwan, Cho, Young-Sang, Yoo, Jongkyu, Lee, Heeseok, Lee, Myunghoon, Yaddanapudi, Vamsi Krishna
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Methodology for accurate junction temperature estimation of SIP(System in Package)
IM, Yunhyeok, KWON, Heunghyu, KIM, Senyun, KIM, Tongsuk, CHO, Taeje, OH, Seyong
Published in Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) (2004)
Published in Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) (2004)
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Conference Proceeding
Impact of Chip, Package, and Set Design on Transient Temperature in Mobile Application
Yoo, Jongkyu, Im, Yunhyeok, Lee, Heeseok, Cho, Young-Sang, An, Taekeun, Lee, Hoi-Jin, Shin, Youngmin
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Thermal Sensor Placement based on Meta-Model Enhancing Observability and Controllability
Im, Yunhyeok, Kim, Wook, An, Taekeun, Lee, Heeseok, Cho, Young-Sang, Yoo, Jongkyu, Lee, Hoi-Jin, Shin, Youngmin, Lee, Myunghoon, Yaddanapudi, Vamsi Krishna
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Micro cooling application on high density memory module
Yunhyeok Im, Hyejung Cho, Minha Kim, Joonghyun Baek
Published in Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003 (2003)
Published in Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003 (2003)
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Conference Proceeding