Scaling analysis of multilevel interconnect temperatures for high-performance ICs
Sungjun Im, Srivastava, N., Banerjee, K., Goodson, K.E.
Published in IEEE transactions on electron devices (01.12.2005)
Published in IEEE transactions on electron devices (01.12.2005)
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Journal Article
System and method to enhance reliability in connection with arrangements including circuits
Lau, Chun Sean, Gill, Paramjeet Singh, Teh, Weng-Hong, Yu, Lee Kong, Chin, Yoong Tatt, Im, Sungjun
Year of Publication 01.03.2022
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Year of Publication 01.03.2022
Patent
System and method to enhance solder joint reliability
Lau, Chun Sean, Gill, Paramjeet Singh, Teh, Weng-Hong, Yu, Lee Kong, Chin, Yoong Tatt, Im, Sungjun
Year of Publication 28.04.2020
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Year of Publication 28.04.2020
Patent
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
Lau, Chun Sean, Gill, Paramjeet Singh, Teh, Weng-Hong, Yu, Lee Kong, Chin, Yoong Tatt, Im, Sungjun
Year of Publication 28.03.2019
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Year of Publication 28.03.2019
Patent
Via design and scaling strategy for nanometer scale interconnect technologies
Sungjun Im, Banerjee, K., Goodson, K.E.
Published in Digest. International Electron Devices Meeting (2002)
Published in Digest. International Electron Devices Meeting (2002)
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Conference Proceeding
Can Carbon Nanotubes Extend the Lifetime of On-Chip Electrical Interconnections?
Banerjee, K., Im, S., Srivastava, N.
Published in 2006 1st International Conference on Nano-Networks and Workshops (01.09.2006)
Published in 2006 1st International Conference on Nano-Networks and Workshops (01.09.2006)
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Conference Proceeding
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
YU, Lee Kong, CHIN, Yoong Tatt, TEH, Weng-Hong, GILL, Paramjeet Singh, IM, Sungjun, LAU, Chun Sean
Year of Publication 24.10.2019
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Year of Publication 24.10.2019
Patent