7.9 1/2.74-inch 32Mpixel-Prototype CMOS Image Sensor with 0.64μ m Unit Pixels Separated by Full-Depth Deep-Trench Isolation
Park, JongEun, Park, Sungbong, Cho, Kwansik, Lee, Taehun, Lee, Changkyu, Kim, DongHyun, Lee, Beomsuk, Kim, SungIn, Ji, Ho-Chul, Im, DongMo, Park, Haeyong, Kim, Jinyoung, Cha, JungHo, Kim, Taehoon, Joe, In-Sung, Hong, Soojin, Chang, Chongkwang, Kim, Jingyun, Shim, WooGwan, Kim, Taehee, Lee, Jamie, Park, Donghyuk, Kim, EuiYeol, Park, Howoo, Lee, Jaekyu, Kim, Yitae, Ahn, JungChak, Hong, YoungKi, Jun, ChungSam, Kim, HyunChul, Moon, Chang-Rok, Kang, Ho-Kyu
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13.02.2021)
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Image sensor and method of fabricating thereof
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Year of Publication 12.02.2019
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