by Filippi, R.G, Gribelyuk, M.A, Joseph, T, Kane, T, Sullivan, T.D, Clevenger, L.A, Costrini, G, Gambino, J, Iggulden, R.C, Kiewra, E.W, Ning, X.J, Ravikumar, R, Schnabel, R.F, Stojakovic, G, Weber, S.J, Gignac, L.M, Hu, C.-K, Rath, D.L, Rodbell, K.P
Published in Thin solid films (01.06.2001)

by Weber, S.J, Iggulden, R.C, Schnabel, R.F, Weigand, P, Restaino, D.D, Brodsky, S.B, Mehter, E.A, Clevenger, L.A
Published in Thin solid films (04.05.1998)

by Schnabel, R.F, Clevenger, L.A, Costrini, G, Dobuzinsky, D.M, Filippi, R, Gambino, J, Lee, G.Y, Iggulden, R.C, Lin, C, Lu, Z.G, Ning, X.J, Ramachandran, R, Ronay, M, Többen, D, Weber, S.J
Published in Microelectronic engineering (2000)

by Ravikumar, R., Filippi, R.G., Iggulden, R.C., Kiewra, E.W., Kirihata, T., Kitahara, H., Lee, G.Y., Liegl, B., Matsunaga, T., Ning, X.J., Rath, D.L., Stojakovic, G., Weber, S.J.
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)

by Clevenger, L.A., Costrini, G., Dobuzinsky, D.M., Filippi, R., Gambino, J., Hoinkis, M., Gignac, L., Hurd, J.L., Iggulden, R.C., Lin, C., Longo, R., Lu, G.Z., Ning, J., Nuetzel, J.F., Ploessl, R., Rodbell, K., Ronay, M., Schnabel, R.F., Tobben, D., Weber, S.J., Chen, L., Chiang, S., Gou, T., Mosely, R., Voss, S., Yang, L.
Published in Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102) (1998)