Hybrid interconnect for low temperature attach
Susheel G Jadhav, Hongjin Jlang, Ibrahim Bekar, Kabirkumar J Mirpuri, Rajen S Sidhu, Tyler N. Osborn
Year of Publication 13.02.2019
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Year of Publication 13.02.2019
Patent
Hybrid interconnect for low temperature attach
Susheel G Jadhav, Hongjin Jlang, Ibrahim Bekar, Kabirkumar J Mirpuri, Tyler Osborn, Rajen S Sidhu
Year of Publication 04.01.2017
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Year of Publication 04.01.2017
Patent
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
Osborn Tyler N, Bekar Ibrahim, Mirpuri Kabirkumar J, Sidhu Rajen S, Jadhav Susheel G, Jiang Hongjin
Year of Publication 08.09.2016
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Year of Publication 08.09.2016
Patent
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
BEKAR, IBRAHIM, OSBORN, TYLER N, SIDHU, RAJEN S, JIANG, HONGJIN, MIRPURI, KABIRKUMAR J, JADHAV, SUSHEEL G
Year of Publication 01.10.2015
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Year of Publication 01.10.2015
Patent
Hybride Zwischenverbindung für Niedertemperatur-Befestigung
Sidhu, Rajen S, Jiang, Hongjin, Jadhav, Susheel G, Mirpuri, Kabirkumar J, Osborn, Tyler N, Bekar, Ibrahim
Year of Publication 01.12.2016
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Year of Publication 01.12.2016
Patent
Hybrid interconnect for low temperature attach
MIRPURI KABIRKUMAR J, JIANG HONGJIN, BEKAR IBRAHIM, OSBORN TYLER N, SIDHU RAJEN S, JADHAV SUSHEEL G
Year of Publication 12.10.2016
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Year of Publication 12.10.2016
Patent
Characterization and modeling of non-linear inelastic behavior of organic packages at component and system levels
Tieyu Zheng, Min Tao, Nardi, P., Modi, M., Sane, S., Bekar, I.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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