Direct CMP process with advanced ELK for 45 nm half pitch interconnects
Seo, T, Oka, Y, Seo, K, Goto, K, Chibahara, H, Korogi, H, Suzuki, S, Hamada, M, Suzumura, N, Tsukamoto, K, Ueki, A, Furuhashi, T, Kodama, D, Kido, S, Izumitani, J, Tomita, K, Kobori, E, Ikeda, A, Kawano, Y, Ueda, T
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Electrical and Mechanical Characteristics of Next-Node Cu Interconnects with Air Gaps
Ueda, T, Harada, T, Ueki, A, Kido, S, Tomita, K, Kanda, Y, Sasaki, T, Tsuji, H, Furuhashi, T, Kabe, T, Shibata, J, Iwasaki, A, Izumitani, J, Kawano, Y, Matsumoto, S
Published in AIP conference proceedings (07.11.2008)
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Published in AIP conference proceedings (07.11.2008)
Journal Article
High-sensitivity infrared characterization of ultrathin SiO2 film by grazing internal reflection method
MATSUI, Y, MIYAGAWA, Y, IZUMITANI, J, OKUYAMA, M, HAMAKAWA, Y
Published in Japanese journal of applied physics (01.02.1992)
Published in Japanese journal of applied physics (01.02.1992)
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Journal Article
Hydrostatische Schlauchwaage
KOBAYASHI, KATSUSHI, KAMIFUKUOKA-SHI, SAITAMA, JP, IZUMITANI, TAKESHI, JP
Year of Publication 29.07.1999
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Year of Publication 29.07.1999
Patent