INTEGRATED CIRCUIT MOUNTING FOR THERMAL STRESS RELIEF USEABLE IN A MULTI-CHIP MODULE
BIANCO, GERRY, BROSZEIT, JUERGEN, GAYOWSKY, GREGORY R, SOTIROPOULOS, GEORGE, ALHAYEK, IYAD, SCHMADLAK, ILKO
Year of Publication 22.09.2010
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Year of Publication 22.09.2010
Patent
Integrated circuit mounting for thermal stress relief useable in a multi-chip module
Alhayek, Iyad, Bianco, Gerry, Broszeit, Juergen, Gayowsky, Gregory R, Schmadlak, Ilko, Sotiropoulos, George
Year of Publication 21.04.2009
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Year of Publication 21.04.2009
Patent
Integrated circuit mounting for thermal stress relief useable in a multi-chip module
ALHAYEK IYAD, BROSZEIT JUERGEN, BIANCO GERRY, SOTIROPOULOS GEORGE, GAYOWSKY GREGORY R, SCHMADLAK ILKO
Year of Publication 21.04.2009
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Year of Publication 21.04.2009
Patent
INTEGRATED CIRCUIT MOUNTING FOR THERMAL STRESS RELIEF USEABLE IN A MULTI-CHIP MODULE
BIANCO, GERRY, BROSZEIT, JUERGEN, GAYOWSKY, GREGORY R, SOTIROPOULOS, GEORGE, ALHAYEK, IYAD, SCHMADLAK, ILKO
Year of Publication 02.07.2008
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Year of Publication 02.07.2008
Patent