Study on Adhesion Improvement of Polyimide Film
Katoh, Kohji, Motobe, Takeharu, Ohe, Masayuki, Soejima, Kazuya, Kaneya, Yuichi, Tanaka, Toshiaki, Itabashi, Toshiaki
Published in Journal of Photopolymer Science and Technology (01.01.2009)
Published in Journal of Photopolymer Science and Technology (01.01.2009)
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Journal Article
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, AND ELECTRONIC COMPONENT
MIZUNO, Kohei, ITABASHI, Toshiaki, MATSUKAWA, Daisaku, YOSHIZAWA, Atsutaro, SAITO, Nobuyuki
Year of Publication 30.06.2022
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Year of Publication 30.06.2022
Patent
High temperature resistant bonding solutions enabling thin wafer processing (Characterization of polyimide base temporary bonding adhesive for thinned wafer handling)
Itabashi, Toshiaki, Zussman, Melvin P
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.01.2010)
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Conference Proceeding
A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing
Yoneda, Satoshi, Adachi, Kenya, Kobayashi, Kaori, Matsukawa, Daisaku, Sasaki, Mamoru, Itabashi, Toshiaki, Shirasaka, Toshiaki, Shibata, Tomoaki
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling
Zoschke, K., Fischer, T., Topper, M., Fritzsch, T., Ehrmann, O., Itabashi, T., Zussman, M. P., Souter, M., Oppermann, H., Lang, K.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding