MEMBER CONNECTION METHOD BY MEANS OF A COPPER SINTERED FILM WITH A PLURALITY OF RADIALLY ARRANGED REGIONS AND A PLURALITY OF CONCENTRICALLY ARRANGED REGIONS
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Year of Publication 07.12.2022
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Year of Publication 07.12.2022
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COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
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Year of Publication 24.11.2022
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Method for producing joined body, and joining material
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GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging
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COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
SUGAMA, Chie, NATORI, Michiko, EJIRI, Yoshinori, NAKAKO, Hideo, KAWANA, Yuki, ISHIKAWA, Dai, NEGISHI, Motohiro
Year of Publication 06.07.2022
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Year of Publication 06.07.2022
Patent
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
SUGAMA, Chie, NATORI, Michiko, NAKAKO, Hideo, KAWANA, Yuki, ISHIKAWA, Dai, NEGISHI, Motohiro
Year of Publication 06.07.2022
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Year of Publication 06.07.2022
Patent
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
SUGAMA, Chie, NATORI, Michiko, EJIRI, Yoshinori, NAKAKO, Hideo, KAWANA, Yuki, ISHIKAWA, Dai, NEGISHI, Motohiro
Year of Publication 06.07.2022
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Year of Publication 06.07.2022
Patent
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
SUGAMA, Chie, NATORI, Michiko, NAKAKO, Hideo, KAWANA, Yuki, ISHIKAWA, Dai, NEGISHI, Motohiro
Year of Publication 06.07.2022
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Year of Publication 06.07.2022
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Evaluation of Microscopic Strain Distribution of Low-Temperature Sintering Die Attach in Thermal Cycling Test
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Published in 2018 20th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2018)
Published in 2018 20th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2018)
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Analysis of Bonding Interfaces of Pressureless-sintered Cu on Metallization Layers
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Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
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Conference Proceeding
MEMBER CONNECTION METHOD
NAKAKO Hideo, EJIRI Yoshinori, SUGAMA Chie, NEGISHI Motohiro, ISHIKAWA Dai, KAWANA Yuki
Year of Publication 16.02.2022
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Year of Publication 16.02.2022
Patent