Reliability Assessment of Stacked-Vias with Different Configurations through a Unit Cell-based Substrate Design
Tunga, Krishna, Ross, Joseph, Iruvanti, Sushumna, Parikh, Bakul, Li, Shidong
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Self-constructed tree-shape high thermal conductivity nanosilver networks in epoxy
Pashayi, Kamyar, Fard, Hafez Raeisi, Lai, Fengyuan, Iruvanti, Sushumna, Plawsky, Joel, Borca-Tasciuc, Theodorian
Published in Nanoscale (21.04.2014)
Published in Nanoscale (21.04.2014)
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Journal Article
On the sintering of gold nanorod assemblies towards continuous networks
Lai, Fengyuan, Borca-Tasciuc, Theodorian, Iruvanti, Sushumna, Plawsky, Joel
Published in RSC advances (01.01.2015)
Published in RSC advances (01.01.2015)
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Journal Article
Self-constructed tree-shape high thermal conductivity nanosilver networks in epoxyElectronic supplementary information (ESI) available: Raman spectroscopy of particles with and without PVP coating, the morphology of uncoated particles, the curing time of samples presented in Fig. 2, optical microscopy images studying the effect of processing time and temperature on nanocomposite agglomeration, measurement results of viscosity versus time for pure epoxy and the 20 vol% silver-epoxy nanocomposite,
Pashayi, Kamyar, Fard, Hafez Raeisi, Lai, Fengyuan, Iruvanti, Sushumna, Plawsky, Joel, Borca-Tasciuc, Theodorian
Year of Publication 27.03.2014
Year of Publication 27.03.2014
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Journal Article
A Study of Organic Chip Carrier Fatigue Cracking
Li, Shidong, Iruvanti, Sushumna, Sikka, Kamal, Wang, Rui
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Multi chip hardware security module
Santiago-Fernandez, William, Iruvanti, Sushumna, Buchling Rego, Philipp K, Hadzic, Nihad, Wassick, Thomas Anthony, Busby, James, Ostrander, Steven Paul
Year of Publication 23.01.2024
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Year of Publication 23.01.2024
Patent
MULTI CHIP HARDWARE SECURITY MODULE
Santiago-Fernandez, William, Iruvanti, Sushumna, Buchling Rego, Philipp K, Hadzic, Nihad, Wassick, Thomas Anthony, Busby, James, Ostrander, Steven Paul
Year of Publication 27.04.2023
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Year of Publication 27.04.2023
Patent
Laminated stiffener to control the warpage of electronic chip carriers
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 12.04.2022
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Year of Publication 12.04.2022
Patent
Hybrid TIMs for electronic package cooling
Chowdhury, Piyas Bal, Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey Allen, Kelly, James J
Year of Publication 01.03.2022
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Year of Publication 01.03.2022
Patent
Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packages
Sinha, Tuhin, Zitz, Jeffery A., Wagner, Rebecca N., Iruvanti, Sushumna
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING
Chowdhury, Piyas Bal, Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey Allen, Kelly, James J
Year of Publication 01.04.2021
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Year of Publication 01.04.2021
Patent