PLANARIZED PLASTIC PACKAGE MODULES FOR INTEGRATED CIRCUITS
CALETKA DAVID V, CARPER JAMES L, VADNAIS MICHAEL J, OSBORNE GORDON C. JR, SMITH ROBERT M, CINCOTTA JOHN P, LAJZA JOHN J. JR, IRISH GARY H, RAMSEY CHARLES R, HORSFORD KIBBY B
Year of Publication 09.01.2002
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Year of Publication 09.01.2002
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Planarized plastic package modules for integrated circuits
CINCOTTA, JOHN P, CALETKA, DAVID V, CARPER, JAMES L, HORSFORD, KIBBY B, IRISH, GARY H.
Year of Publication 11.04.2005
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Year of Publication 11.04.2005
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Leadframe having contact pads defined by a polymer insulating film
RIELEY; SHELDON C, IRISH; GARY H, JACKSON; ROBERT L, CARPER; JAMES L, SMITH; ROBERT M
Year of Publication 07.07.1998
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Year of Publication 07.07.1998
Patent
Planarized plastic package modules for integrated circuits
CINCOTTA, JOHN, P, VADNAIS, MICHAEL, J, HORSFORD, KIBBY, B, OSBORNE, GORDON, C., JR, RAMSEY, CHARLES, R, CARPER, JAMES, L, IRISH, GARY, H, CALETKA, DAVID, V, SMITH, ROBERT, M, LAJZA, JOHN, J., JR
Year of Publication 13.05.2005
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Year of Publication 13.05.2005
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Leadframe having contact pads defined by a polymer insulating film
RIELEY; SHELDON C, IRISH; GARY H, JACKSON; ROBERT L, CARPER; JAMES L, SMITH; ROBERT M
Year of Publication 04.03.1997
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Year of Publication 04.03.1997
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Encapsulated semiconductor chip module and method of forming the same
SHAIKH; MOHAMMED S, FROEBEL; FRANCIS E, GARDELL; DAVID L, IRISH; GARY H
Year of Publication 17.12.1996
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Year of Publication 17.12.1996
Patent
Planarized plastic package modules for integrated circuits
CALETKA DAVID V, CARPER JAMES L, LAJZA, JR. JOHN J, VADNAIS MICHAEL J, SMITH ROBERT M, CINCOTTA JOHN P, IRISH GARY H, RAMSEY CHARLES R, HORSFORD KIBBY B, OSBORNE, JR. GORDON C
Year of Publication 05.08.2003
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Year of Publication 05.08.2003
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FLATTENED PLASTIC PACKAGE MODULE FOR INTEGRATED CIRCUIT
CALETKA DAVID V, OSBORNE GORDON C JR, CARPER JAMES L, VADNAIS MICHAEL J, SMITH ROBERT M, CINCOTTA JOHN P, LAJZA JOHN J JR, IRISH GARY H, RAMSEY CHARLES R, HORSFORD KIBBY B
Year of Publication 08.02.2002
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Year of Publication 08.02.2002
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Planarized thin film surface covered wire bonded semiconductor package
STARR; STEPHEN G, PAKULSKI; FRANCIS J, IRISH; GARY H, SLATTERY; WILLIAM J, CONRU; H. WARD, WARD; WILLIAM C
Year of Publication 29.09.1992
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Year of Publication 29.09.1992
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Method of making a planarized thin film covered wire bonded semiconductor package
STARR; STEPHEN G, PAKULSKI; FRANCIS J, IRISH; GARY H, SLATTERY; WILLIAM J, CONRU; H. WARD, WARD; WILLIAM C
Year of Publication 04.02.1992
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Year of Publication 04.02.1992
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