Three-dimensional silicon integration
Knickerbocker, J U, Andry, P S, Dang, B, Horton, R R, Interrante, M J, Patel, C S, Polastre, R J, Sakuma, K, Sirdeshmukh, R, Sprogis, E J, Sri-Jayantha, S M, Stephens, A M, Topol, A W, Tsang, C K, Webb, B C, Wright, S L
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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3D chip stacking with C4 technology
Dang, B, Wright, S L, Andry, P S, Sprogis, E J, Tsang, C K, Interrante, M J, Webb, B C, Polastre, R J, Horton, R R, Patel, C S, Sharma, A, Zheng, J, Sakuma, K, Knickerbocker, J U
Published in IBM journal of research and development (01.11.2008)
Published in IBM journal of research and development (01.11.2008)
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Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
Dang, Bing, Interrante, Mario J, Knickerbocker, John, Tran, Son Kim, Bernier, William Emmett
Year of Publication 07.11.2023
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Year of Publication 07.11.2023
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Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection
TRAN, SON KIM, Interrante, Mario J, BERNIER, William EMMETT, DANG, BING, KNICKERBOCKER, JOHN
Year of Publication 16.09.2021
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Year of Publication 16.09.2021
Patent
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
Dang, Bing, Interrante, Mario J, Knickerbocker, John, Tran, Son Kim, Bernier, William Emmett
Year of Publication 29.06.2021
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Year of Publication 29.06.2021
Patent