Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages
Swaminathan, Shrikant, Sikka, Kamal K., Indyk, Richard F., Sinha, Tuhin
Published in Microelectronics and reliability (01.11.2016)
Published in Microelectronics and reliability (01.11.2016)
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Polygon integrated circuit (IC) packaging
Indyk, Richard F, Singh, Bhupender, Li, Shidong, Arvin, Charles L, Casey, Jon A
Year of Publication 09.08.2022
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Year of Publication 09.08.2022
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POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
Indyk, Richard F, Singh, Bhupender, Li, Shidong, Arvin, Charles L, Casey, Jon A
Year of Publication 11.03.2021
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Year of Publication 11.03.2021
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Edge trim processes and resultant structures
Sprogis, Edmund J, Indyk, Richard F, Skordas, Spyridon, Stamper, Anthony K, Priyadarshini, Deepika, Winstel, Kevin R
Year of Publication 20.11.2018
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Year of Publication 20.11.2018
Patent
Dicing channels for glass interposers
Hedrick, Brittany L, Indyk, Richard F, Sukumaran, Vijay, Knickerbocker, Sarah H, Tessler, Christopher L
Year of Publication 02.10.2018
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Year of Publication 02.10.2018
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Structure for establishing interconnects in packages using thin interposers
Cox, Harry, Fasano, Benjamin V, Indyk, Richard F, Cranmer, Michael S, Sakuma, Katsuyuki, Perfecto, Eric D
Year of Publication 19.06.2018
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Year of Publication 19.06.2018
Patent
DICING CHANNELS FOR GLASS INTERPOSERS
Tessler Christopher L, Indyk Richard F, Hedrick Brittany L, Knickerbocker Sarah H, Sukumaran Vijay
Year of Publication 03.08.2017
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Year of Publication 03.08.2017
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METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USING THIN INTERPOSERS
FASANO Benjamin V, COX Harry, CRANMER Michael S, PERFECTO Eric D, INDYK Richard F, SAKUMA Katsuyuki
Year of Publication 25.05.2017
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Year of Publication 25.05.2017
Patent
Method for establishing interconnects in packages using thin interposers
Sakuma Katsuyuki, Perfecto Eric D, Fasano Benjamin V, Indyk Richard F, Cranmer Michael S, Cox Harry
Year of Publication 28.03.2017
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Year of Publication 28.03.2017
Patent
EDGE TRIM PROCESSES AND RESULTANT STRUCTURES
PRIYADARSHINI Deepika, SKORDAS Spyridon, STAMPER Anthony K, SPROGIS Edmund J, INDYK Richard F, WINSTEL Kevin R
Year of Publication 24.11.2016
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Year of Publication 24.11.2016
Patent
SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT
OSTRANDER STEVEN P, INDYK RICHARD F, SINGH BHOOPENDER, ARVIN CHARLES L, KAPAMMER MARK W, WEISS THOMAS
Year of Publication 09.11.2021
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Year of Publication 09.11.2021
Patent
Wafer dicing employing edge region underfill removal
NAH JAE-WOONG, INDYK RICHARD F, KATSURAYAMA SATORU, OKADA SHIGEFUMI, OKA DAISUKE
Year of Publication 18.02.2014
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Year of Publication 18.02.2014
Patent
WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL
NAH JAE-WOONG, INDYK RICHARD F, KATSURAYAMA SATORU, OKADA SHIGEFUMI, OKA DAISUKE
Year of Publication 13.06.2013
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Year of Publication 13.06.2013
Patent