Effects of Electroplating at Lower Leveler and Suppressor Contents on the Formation of Very Low Resistivity Narrow Cu Interconnects
Miyamoto, Ryo, Tamahashi, Kunihiro, Inami, Takashi, Sasajima, Yasushi, Onuki, Jin
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article
Impact of Electroplating at Lower Leveler Content on the Formation of Low Resistivity Narrow Cu Interconnects
Inami, Takashi, Miyamoto, Ryo, Tamahashi, Kunihiro, Namekawa, Takashi, Ishikawa, Nobuhiro, Ito, Masahiko, Onuki, Jin
Published in Journal of the Electrochemical Society (01.01.2017)
Published in Journal of the Electrochemical Society (01.01.2017)
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Journal Article
Grain Size Distribution at the Bottom Region in Very Narrow Cu Interconnects
INAMI, Takashi, TAMAHASHI, Kunihiro, NAMEKAWA, Takashi, CHIBA, Akio, ONUKI, Jin
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.03.2016)
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.03.2016)
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Journal Article
Nano-Structure-Controlled Very Low Resistivity Cu Wires Formed by High Purity and Optimized Additives
Onuki, Jin, Tamahashi, Kunihiro, Inami, Takashi, Nagano, Takatoshi, Sasajima, Yasushi, Ikeda, Shuji
Published in IEEE journal of the Electron Devices Society (01.01.2018)
Published in IEEE journal of the Electron Devices Society (01.01.2018)
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Journal Article
In-situ Observation of the Reduction of Iron Oxides by Solid State Carbon in TEM
Ishikawa, Nobuhiro, Furuya, Kazuo, Mitsuoka, Nayuta, Inami, Takashi
Published in ISIJ International (2006)
Published in ISIJ International (2006)
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Journal Article
EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires
Ke, Y, Namekawa, T, Tamahashi, K, Inami, T, Onuki, J
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.04.2013)
Published in Denki kagaku oyobi kōgyō butsuri kagaku (01.04.2013)
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Journal Article
TEM Observation of the Reduction of Wustite by Hydrogen Ion Implantation
Ishikawa, Nobuhiro, Song, Mingui, Mitsuishi, Kazutaka, Furuya, Kazuo, Watanabe, Yoshimi, Inami, Takashi
Published in ISIJ International (01.01.2004)
Published in ISIJ International (01.01.2004)
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Journal Article
High-Temperature Cycle Durability of Superplastic Al-Zn Eutectoid Solder Joints With Stress Relaxation Characteristics for SiC Power Semiconductor Devices
Saito, Katsuaki, Tamahashi, Kunihiro, Inami, Takashi, Kobiyama, Mamoru, Sasajima, Yasushi, Onuki, Jin, Kawamata, Yuji
Published in IEEE electron device letters (01.02.2019)
Published in IEEE electron device letters (01.02.2019)
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Journal Article
Visit to valuable Water Springs (146) Valuable springs in the Oigawa basin
KUDO, Keishi, NOMURA, Shinji, SUGIYAMA, Kotaro, ASAMI, Kazuki, KAMEI, Hiroko, MURAMOTO, Daisuke, INAMI, Takashi
Published in Chikasui Gakkai shi (31.08.2024)
Published in Chikasui Gakkai shi (31.08.2024)
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Journal Article
COPPER WIRING AND MANUFACTURING METHOD OF THE SAME
TAMAHASHI KUNIHIRO, ITO MASAHIKO, SHINOJIMA YASUSHI, INAMI TAKASHI, ONUKI HITOSHI
Year of Publication 13.09.2018
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Year of Publication 13.09.2018
Patent
Highly reliable high-temperature superplastic Al-Zn eutectoid solder joining with stress relaxation characteristics for next generation SiC power semiconductor devices
Onuki, Jin, Chiba, Akio, Kawakami, Mitsuo, Tamahashi, Kunihiro, Sugawara, Yoshitaka, Inami, Takashi, Kobiyama, Mamoru, Motohashi, Yoshinobu, Kawamata, Yuji
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01.05.2017)
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01.05.2017)
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Conference Proceeding
BUFFER CONSTRUCTION
TAKAHASHI KAZUYA, DOI TETSUYA, NOZAWA GOJIRO, INAMI TAKASHI, TANIGAWA MASAKI, IWANAGA KEIICHIRO
Year of Publication 25.07.2016
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Year of Publication 25.07.2016
Patent