AlN filler for high thermal conductive resin materials
Inaki, Yoshitaka, Inagawa, Hisamori, Fujii, Saiko, Masada, Isao, Nawata, Teruhiko, Kanechika, Yukihiro
Published in 2020 International Symposium on Semiconductor Manufacturing (ISSM) (15.12.2020)
Published in 2020 International Symposium on Semiconductor Manufacturing (ISSM) (15.12.2020)
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Conference Proceeding
Aluminum Nitride Filler for Thermally Conductive Resin Materials
Tsuchida, Koki, Tanaka, Suzu, Inagawa, Hisamori, Inaki, Yoshitaka
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding