Cool Interconnect: A 1024-bit Wide Bus for Chip-to-Chip Communications in 3-D Integrated Circuits
Melamed, Samson, Imura, Fumito, Nakagawa, Hiroshi, Kikuchi, Katsuya, Hagimoto, Michiya, Matsumoto, Yukoh, Aoyagi, Masahiro
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2019)
Get full text
Journal Article
Functional demonstration of the ability of a primary spermatogonium as a stem cell by tracing a single cell destiny in Xenopus laevis
Kawasaki, Toshihiro, Imura, Fumito, Nakada, Akira, Kubota, Hiroshi, Sakamaki, Kazuhiro, Abe, Shin‐Ichi, Takamune, Kazufumi
Published in Development, growth & differentiation (01.10.2006)
Published in Development, growth & differentiation (01.10.2006)
Get full text
Journal Article
Via Interconnections for Half-Inch Sized Package Fabricated by Minimal Fab
Imura, Fumito, Inoue, Michihiro, Khumpuang, Sommawan, Hara, Shiro
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Get full text
Conference Proceeding
Attoliter Control of Microliquid
Imura, Fumito, Kuroiwa, Hiroyuki, Nakada, Akira, Kosaka, Kouji, Kubota, Hiroshi
Published in Japanese Journal of Applied Physics (01.11.2007)
Published in Japanese Journal of Applied Physics (01.11.2007)
Get full text
Journal Article
Development of micro bump joints fabrication process using cone shape Au bumps for 3D LSI chip stacking
Imura, Fumito, Watanabe, Naoya, Nemoto, Shunsuke, Wei Feng, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, Masashiro
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Get full text
Conference Proceeding
PLATING DEVICE HOLDING WAFER BY HOLDER
IMURA FUMITO, MORISONO TETSUYA, HARA SHIRO, KUMPUAN SOMAWANG, KAMASAKI KAYO, YOSHINAGA TAKAFUMI, KIKUNO TOSHIHIRO, ISHIDA YUKI, FUKUYAMA MITSUHIKO
Year of Publication 04.11.2022
Get full text
Year of Publication 04.11.2022
Patent
Wide bus chip-to-chip interconnection technology using fine pitch bump joint array for 3D LSI chip stacking
Aoyagi, M., Imura, F., Nemoto, S., Watanabe, N., Kato, F., Kikuchi, K., Nakagawa, H., Hagimoto, M., Uchida, H., Matsumoto, Y.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Get full text
Conference Proceeding
SURFACE MOUNT PACKAGE AND MANUFACTURING METHOD THEREOF
IMURA FUMITO, HARA SHIRO, INOUE MICHIHIRO, KHUMPUANG SOMMAWAN, SARUWATARI ARAMI
Year of Publication 02.06.2016
Get full text
Year of Publication 02.06.2016
Patent
SYSTEM FOR INTEGRATING PRECEDING STEPS AND SUBSEQUENT STEPS
IMURA FUMITO, INOUE MICHIHIRO, HARA SHIRO, KHUMPUANG SOMMAWAN, SARUWATARI ARAMI
Year of Publication 02.06.2016
Get full text
Year of Publication 02.06.2016
Patent
CIRCULAR SUPPORT SUBSTRATE FOR SEMICONDUCTOR
IMURA FUMITO, HARA SHIRO, INOUE MICHIHIRO, KHUMPUANG SOMMAWAN, SARUWATARI ARAMI
Year of Publication 02.06.2016
Get full text
Year of Publication 02.06.2016
Patent
COOL interconnect low power interconnection technology for scalable 3D LSI design
Chacin, M., Uchida, H., Hagimoto, M., Miyazaki, T., Ohkawa, T., Ikeno, R., Matsumoto, Y., Imura, F., Suzuki, M., Kikuchi, K., Nakagawa, H., Aoyagi, M.
Published in 2011 IEEE Cool Chips XIV (01.04.2011)
Published in 2011 IEEE Cool Chips XIV (01.04.2011)
Get full text
Conference Proceeding
Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology
AOYAGI, Masahiro, IMURA, Fumito, KATO, Fumiki, KIKUCHI, Katsuya, WATANABE, Naoya, SUZUKI, Motohiro, NAKAGAWA, Hiroshi, OKADA, Yoshikuni, YOKOSHIMA, Tokihiko, YAMAJI, Yasuhiro, NEMOTO, Shunsuke, BUI, Tung Thanh, MELAMED, Samson
Published in Synthesiology (2016)
Published in Synthesiology (2016)
Get full text
Journal Article
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
IMURA FUMITO, KIKUCHI KATSUYA, FENG WEI, AOYAGI MASAHIRO, WATANABE NAOYA, KATO FUMIKI, NAKAGAWA HIROSHI, NEMOTO SHUNSUKE
Year of Publication 26.03.2015
Get full text
Year of Publication 26.03.2015
Patent