Enhanced breakdown voltage and low inductance of All-SiC module
Hori, Motohito, Hinata, Yuichiro, Taniguchi, Katsumi, Ikeda, Yoshinari, Yamazaki, Tomoyuki
Published in 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2018)
Published in 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.05.2018)
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Conference Proceeding
Universal Smart Power Module (USPM) for Carbon Neutral Society
Takahashi, Yoshikazu, Ikeda, Yoshinari, Watanabe, Hiroki, Itoh, Jun-ichi
Published in 2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) (15.05.2022)
Published in 2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia) (15.05.2022)
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Conference Proceeding
Universal Smart Power Module (USPM) for Carbon Neutral Society
Watanabe, Hiroki, Yamanokuchi, Koki, Ikeda, Yoshinari, Takahashi, Yoshikazu, Itoh, Jun-ichi
Published in IEEE transactions on industry applications (01.03.2024)
Published in IEEE transactions on industry applications (01.03.2024)
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Journal Article
A study on the reliability of the chip surface solder joint
Ikeda, Y., Iizuka, Y., Asai, T., Goto, T., Takahashi, Y.
Published in 2008 20th International Symposium on Power Semiconductor Devices and IC's (01.05.2008)
Published in 2008 20th International Symposium on Power Semiconductor Devices and IC's (01.05.2008)
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Conference Proceeding
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
KATO RYOICHI, TANIGUCHI KATSUMI, IKEDA YOSHINARI, MURATA YUMA, NAKAGOME AKITO
Year of Publication 02.05.2023
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Year of Publication 02.05.2023
Patent