Semiconductor component, has electrical connection established in inner side of semiconductor component by conductor boards, which are arranged in three-dimensional manner such that respective welding positions are provided at boards
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Year of Publication 17.04.2008
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Semiconductor apparatus
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Year of Publication 17.04.2008
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Year of Publication 02.09.2005
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POWER SEMICONDUCTOR MODULE
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Year of Publication 28.04.2005
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Year of Publication 24.02.2005
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SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
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Year of Publication 19.05.2005
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Year of Publication 19.05.2005
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