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PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH ADHESIVE TAPE, LEAD FRAME WITH ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING LEAD FRAME
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, HOSOGAWA YOUICHI, YANAGISAWA SATORU, KIRIHARA HIROSHI
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Year of Publication 07.11.2003
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Year of Publication 11.11.2004
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Year of Publication 11.11.2004
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PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
Year of Publication 28.01.1999
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Year of Publication 28.01.1999
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PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 22.01.2009
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Year of Publication 22.01.2009
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 11.11.2008
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Year of Publication 11.11.2008
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 11.11.2008
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Year of Publication 11.11.2008
Patent
PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR
YOSHIYUKI TANABE, YOUICHI HOSOKAWA, SHINJI IIOKA, YOSHIHIRO NOMURA, HIROSHI KIRIHARA, SATORU YANAGISAWA
Year of Publication 31.12.2007
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Year of Publication 31.12.2007
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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 25.09.2007
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Year of Publication 25.09.2007
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 25.09.2007
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Year of Publication 25.09.2007
Patent
PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
YOSHIYUKI TANABE, YOUICHI HOSOKAWA, SHINJI IIOKA, YOSHIHIRO NOMURA, HIROSHI KIRIHARA, SATORU YANAGISAWA
Year of Publication 29.04.2006
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Year of Publication 29.04.2006
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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 09.02.2006
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Year of Publication 09.02.2006
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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
Year of Publication 20.04.2005
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Year of Publication 20.04.2005
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