SEMICONDUCTOR DEVICE
HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Year of Publication 08.12.1998
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Year of Publication 08.12.1998
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MANUFACTURING OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Year of Publication 08.12.1998
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Year of Publication 08.12.1998
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FILM WITH HEAT-RESISTANT ADHESIVE LAYER AND SEMICONDUCTOR DEVICE PREPARED BY USING THE SAME
HOSOKAWA YOICHI, IIOKA SHINJI, NOMURA YOSHIHIRO, TANABE YOSHIYUKI, KIRIHARA HIROSHI
Year of Publication 30.06.1998
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Year of Publication 30.06.1998
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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 25.02.2003
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Year of Publication 25.02.2003
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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 25.02.2003
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Year of Publication 25.02.2003
Patent
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
Tanabe, Yoshiyuki, Nomura, Yoshihiro, Kirihara, Hiroshi, Hosokawa, Youichi, Iioka, Shinji, Yanagisawa, Satoru
Year of Publication 30.01.2003
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Year of Publication 30.01.2003
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Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
IIOKA SHINJI, TANABE YOSHIYUKI, NOMURA YOSHIHIRO, YANAGISAWA SATORU, HOSOKAWA YOUICHI, KIRIHARA HIROSHI
Year of Publication 30.01.2003
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Year of Publication 30.01.2003
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PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
Year of Publication 29.08.2001
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Year of Publication 29.08.2001
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PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME
HOSOKAWA, YOUICHI, NOMURA, YOSHIHIRO, IIOKA, SHINJI, YANAGISAWA, SATORU, TANABE, YOSHIYUKI, KIRIHARA, HIROSHI
Year of Publication 11.07.2001
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Year of Publication 11.07.2001
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ADHESIVE FOR ELECTRONIC PARTS, ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING THEM
HOSOKAWA YOICHI, NAGOYA TOMOHIRO, IIOKA SHINJI, NOMURA YOSHIHIRO, SHIMADA YASUSHI, YANAGISAWA SATOSHI, KIRIHARA HIROSHI
Year of Publication 27.06.2000
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Year of Publication 27.06.2000
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RESIN COMPOSITION AND ADHESIVE FILM
SUZUKI, MASAHIRO, NISHIMURA, SHIN, SUZUKI, MASAO, TAKAHASHI, AKIO, KAGEYAMA, AKIRA, HONDA, YOSHIHIKO, KAWAI, TOSHIYASU, IIOKA, SHINJI, NOMURA, YOSHIHIRO
Year of Publication 17.10.2002
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Year of Publication 17.10.2002
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RESIN COMPOSITION AND ADHESIVE FILM
SUZUKI MASAO, SUZUKI MASAHIRO, IIOKA SHINJI, NOMURA YOSHIHIRO, KAGEYAMA AKIRA, TAKAHASHI AKIO, KAWAI TOSHIYASU, NISHIMURA SHIN, HONDA YOSHIHIKO
Year of Publication 17.10.2002
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Year of Publication 17.10.2002
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Adhesive film of quinoline polymer and bismaleimide
Suzuki, Masahiro, Nishimura, Shin, Suzuki, Masao, Takahashi, Akio, Kageyama, Akira, Honda, Yoshihiko, Kawai, Toshiyasu, Iioka, Shinji, Nomura, Yoshihiro
Year of Publication 08.10.2002
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Year of Publication 08.10.2002
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Adhesive film of quinoline polymer and bismaleimide
SUZUKI MASAO, SUZUKI MASAHIRO, IIOKA SHINJI, NOMURA YOSHIHIRO, KAGEYAMA AKIRA, TAKAHASHI AKIO, KAWAI TOSHIYASU, NISHIMURA SHIN, HONDA YOSHIHIKO
Year of Publication 08.10.2002
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Year of Publication 08.10.2002
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RESIN COMPOSITION AND ADHESIVE FILM
SUZUKI MASAO, SUZUKI MASAHIRO, IIOKA SHINJI, NOMURA YOSHIHIRO, KAGEYAMA AKIRA, TAKAHASHI AKIO, NISHIMURA SHIN, HONDA YOSHIHIKO, KAWAI AKIYASU
Year of Publication 22.12.1998
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Year of Publication 22.12.1998
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