Electromigration in AlCu lines: comparison of Dual Damascene and metal reactive ion etching
Filippi, R.G, Gribelyuk, M.A, Joseph, T, Kane, T, Sullivan, T.D, Clevenger, L.A, Costrini, G, Gambino, J, Iggulden, R.C, Kiewra, E.W, Ning, X.J, Ravikumar, R, Schnabel, R.F, Stojakovic, G, Weber, S.J, Gignac, L.M, Hu, C.-K, Rath, D.L, Rodbell, K.P
Published in Thin solid films (01.06.2001)
Published in Thin solid films (01.06.2001)
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Journal Article
Temperature dependence of the Al-fill processes for submicron-via structures
Weber, S.J, Iggulden, R.C, Schnabel, R.F, Weigand, P, Restaino, D.D, Brodsky, S.B, Mehter, E.A, Clevenger, L.A
Published in Thin solid films (04.05.1998)
Published in Thin solid films (04.05.1998)
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Conference Proceeding
Aluminum dual damascene metallization for 0.175 μm DRAM generations and beyond ( invited)
Schnabel, R.F, Clevenger, L.A, Costrini, G, Dobuzinsky, D.M, Filippi, R, Gambino, J, Lee, G.Y, Iggulden, R.C, Lin, C, Lu, Z.G, Ning, X.J, Ramachandran, R, Ronay, M, Többen, D, Weber, S.J
Published in Microelectronic engineering (2000)
Published in Microelectronic engineering (2000)
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Journal Article
Conference Proceeding
An Investigation of the Stability and Tailorability of Coated Alumina Reinforced Titanium Metal Matrix Composites
Iggulden, Roy C, Moon, Cheol-Hee, Stone, Donald S, Chang, Y.A
Published in Scripta materialia (06.01.1998)
Published in Scripta materialia (06.01.1998)
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Journal Article
Cleans for Al vias in a 0.175 μm dual damascene process
GAMBINO, J, CLEVENGER, L, BRULEY, J, DOMENICUCCI, A, COSTRINI, G, SCHNABEL, F, RAVIKUMAR, R, DOBUZINSKY, D, IGGULDEN, R, DZIOBKOWSKI, C, WILDMAN, H, BENEDICT, J
Year of Publication 1999
Year of Publication 1999
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Conference Proceeding
Challenges of aluminum RIE technology at sub 0.45 μm pitches
RAVIKUMAR, R, FILIPPI, R. G, RATH, D. L, STOJAKOVIC, G, WEBER, S. J, IGGULDEN, R. C, KIEWRA, E. W, KIRIHATA, T, KITAHARA, H, LEE, G. Y, LIEGL, B, MATSUNAGA, T, NING, X. J
Year of Publication 1999
Year of Publication 1999
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Conference Proceeding
Aluminum dual damascene metallization for 0.175 mu m DRAM generations and beyond
Schnabel, R F, Clevenger, L A, Costiri, G, Dobuzinsky, D M, Filippi, R, Gambino, J, Lee, G Y, Iggulden, R C, Lin, C, Lu, Z G
Published in Microelectronic engineering (07.03.1999)
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Published in Microelectronic engineering (07.03.1999)
Journal Article
Cleans for Al vias in a 0.175 /spl mu/m dual damascene process
Gambino, J., Clevenger, L., Costrini, G., Schnabel, F., Ravikumar, R., Dobuzinsky, D., Iggulden, R., Dziobkowski, C., Wildman, H., Benedict, J., Bruley, J., Domenicucci, A.
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)
Published in Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) (1999)
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Conference Proceeding
Slotted vias for dual damascene interconnects in 1 Gb DRAMs
Schnabel, R.F., Bronner, G., Clevenger, L., Dobuzinsky, D., Costrini, G., Filippi, R., Gambino, J., Hug, M., Iggulden, R., Lin, C., Muller, K.P., Mueller, G., Nuetzel, J., Radens, C., Weber, S., Zach, F.
Published in 1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325) (1999)
Published in 1999 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.99CH36325) (1999)
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Conference Proceeding