by Garimella, S.V., Fleischer, A.S., Murthy, J.Y., Keshavarzi, A., Prasher, R., Patel, C., Bhavnani, S.H., Venkatasubramanian, R., Mahajan, R., Joshi, Y., Sammakia, B., Myers, B.A., Chorosinski, L., Baelmans, M., Sathyamurthy, P., Raad, P.E.
Published in IEEE transactions on components and packaging technologies (01.12.2008)

by Lei, Thomas Guangyin, Calata, Jesus Noel, Lu, Guo-Quan, Chen, Xu, Luo, Shufang
Published in IEEE transactions on components and packaging technologies (01.03.2010)

by Xingwen Li, Xingwen Li, Degui Chen, Degui Chen
Published in IEEE transactions on components and packaging technologies (01.12.2005)

by Vichare, N.M., Pecht, M.G.
Published in IEEE transactions on components and packaging technologies (01.03.2006)

by Tao Tong, Yang Zhao, Delzeit, L., Kashani, A., Meyyappan, M., Majumdar, A.
Published in IEEE transactions on components and packaging technologies (01.03.2007)

by Bai, J.G., Zhiye Zach Zhang, Calata, J.N., Guo-Quan Lu
Published in IEEE transactions on components and packaging technologies (01.09.2006)

by Bieler, T.R., Hairong Jiang, Lehman, L.P., Kirkpatrick, T., Cotts, E.J., Nandagopal, B.
Published in IEEE transactions on components and packaging technologies (01.06.2008)

by Jaeseon Lee, Mudawar, I.
Published in IEEE transactions on components and packaging technologies (01.06.2009)

by Jain, A., Jones, R.E., Chatterjee, R., Pozder, S.
Published in IEEE transactions on components and packaging technologies (01.03.2010)

by Visaria, M., Mudawar, I.
Published in IEEE transactions on components and packaging technologies (01.12.2009)

by Sung, D., de la Fuente Vornbrock, A., Subramanian, V.
Published in IEEE transactions on components and packaging technologies (01.03.2010)

by Mudawar, I., Bharathan, D., Kelly, K., Narumanchi, S.
Published in IEEE transactions on components and packaging technologies (01.06.2009)

by Yovanovich, M.M.
Published in IEEE transactions on components and packaging technologies (01.06.2005)

by Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.
Published in IEEE transactions on components and packaging technologies (01.06.2007)

by Mustain, H A, Brown, W D, Ang, S S
Published in IEEE transactions on components and packaging technologies (01.09.2010)

by Lijun Gao, Shengyi Liu, Dougal, R.A.
Published in IEEE transactions on components and packaging technologies (01.09.2002)

by Zhiyi Zhang, Gao Zhi Xiao, Jiaren Liu, Grover, C.P., Nikumb, S., Reshef, H.W.
Published in IEEE transactions on components and packaging technologies (01.09.2005)

by Liu, Zong-Yuan, Liu, Sheng, Wang, Kai, Luo, Xiao-Bing
Published in IEEE transactions on components and packaging technologies (01.12.2010)

by Mudawar, I.
Published in IEEE transactions on components and packaging technologies (01.06.2001)

by Subramanian, V., Chang, P.C., Lee, J.B., Molesa, S.E., Volkman, S.K.
Published in IEEE transactions on components and packaging technologies (01.12.2005)