Search Results - "IEEE transactions on components and packaging technologies" :: K.UTB vyhledávací portál

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Compact thermal networks for modeling packages

by Codecasa, L., D'Amore, D., Maffezzoni, P.
Published in IEEE transactions on components and packaging technologies (01.03.2004)

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Fluxless Soldering of Copper Substrates Using Self-Assembled Monolayers for Preservation

by Changqing Liu, Hutt, D.A.
Published in IEEE transactions on components and packaging technologies (01.09.2006)

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Transient junction-to-case thermal resistance measurement methodology of high accuracy and high repeatability

by Szabo, P., Steffens, O., Lenz, M., Farkas, G.
Published in IEEE transactions on components and packaging technologies (01.12.2005)

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Mechanical FEM Simulation of bonding process on Cu lowK wafers

by Degryse, D., Vandevelde, B., Beyne, E.
Published in IEEE transactions on components and packaging technologies (01.12.2004)

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Optimization of thermal interface materials for electronics cooling applications

by Vishal Singhal, Siegmund, T., Garimella, S.V.
Published in IEEE transactions on components and packaging technologies (01.06.2004)

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Study of Temperature Change and Vibration Induced Fretting on Intrinsically Conducting Polymer Contact Systems

by Swingler, Jonathan, Lam, Liza, McBride, John W
Published in IEEE transactions on components and packaging technologies (01.06.2010)

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Experimental Study on Pressure Drop Characteristics of Vents

by Dhanushkodi, Ganesan
Published in IEEE transactions on components and packaging technologies (01.06.2010)

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Finite element modeling of electronic packages subjected to drop impact

by Tan, V.B.C., Tong, M.X., Kian Meng Lim, Chwee Teck Lim
Published in IEEE transactions on components and packaging technologies (01.09.2005)

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Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads

by Lall, P., Choudhary, P., Gupte, S., Hofmeister, J.
Published in IEEE transactions on components and packaging technologies (01.09.2009)

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Response Surface Based Optimization Approach for Thermal Placement Design of Chips in Multiple-Chip Modules

by Chen, Wen-Hwa, Cheng, Hsien-Chie, Chung, I-Chun
Published in IEEE transactions on components and packaging technologies (01.09.2009)

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Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis

by Etessam-Yazdani, K., Asheghi, M., Hamann, H.F.
Published in IEEE transactions on components and packaging technologies (01.03.2008)

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Optimization of Epoxy-Barium Titanate Nanocomposites for High Performance Embedded Capacitor Components

by Jianwen Xu, Kyoung-Sik Moon, Pramanik, P., Bhattacharya, S., Wong, C.P.
Published in IEEE transactions on components and packaging technologies (01.06.2007)

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Residual Strain Measurement of Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic Packaging

by Tsai, Ming-Yi, Chiang, Chih-Yao, Huang, Chen-Yu, Yang, Sheng-Shu
Published in IEEE transactions on components and packaging technologies (01.03.2010)

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A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

by Rencz, M., Szekely, V., Poppe, A.
Published in IEEE transactions on components and packaging technologies (01.09.2007)

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Moisture Lifetime Testing of RF MEMS Switches Packaged in Liquid Crystal Polymer

by Kingsley, N., Bhattacharya, S.K., Papapolymerou, J.
Published in IEEE transactions on components and packaging technologies (01.06.2008)

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Our Thanks to Reviewers

by Anon., Anon
Published in IEEE transactions on components and packaging technologies (01.12.2010)

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Editorial - Science, Technology, and Industrial Policy

by Pecht, Michael G., Zuga, Len
Published in IEEE transactions on components and packaging technologies (01.12.2010)

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Editorial For a Brighter Future: Solid State Lighting

by Arik, Mehmet, Bar-Cohen, Avram, Pautsch, Adam
Published in IEEE transactions on components and packaging technologies (01.12.2010)

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IEEE Components, Packaging, and Manufacturing Technology Society Information

by Anon., Anon
Published in IEEE transactions on components and packaging technologies (01.12.2010)

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Glowing Connection Experiments With Alternating Currents Below 1 rm A rm rms

by Urbas, Joe
Published in IEEE transactions on components and packaging technologies (01.12.2010)

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