Mold compound selection study for CMOS90 176 lead LQFP 24×24mm package
Teng Seng Kiong, Ruzaini, I., Hian, S. T. S.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
Package warpage challenges for LQFP 144 lead CMOS 90 device and it's impact to lead coplanarity
Teng Seng Kiong, Ruzaini, Ibrahim, Kesvakumar, Foong Chee Seng
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Thermally enhanced PBGA: Effect of heat spreader design on plasma cleaning efficiency and wire sweep
Poh-Leng Eu, Ibrahim, R, Kai-Yun Yow
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Mold process development of C90 LowK and ultra-finepitch BGA for robust reliability performance
Ibrahim, R., Boon-Yew Low, Zi-Song Poh
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Top-Gate Molding Process Development of Cavity Down TBGA for High Density Wire Bonding and Low K Dielectric Wafer Technology Application
Muniandy, K., Ruzaini, I., Shim Kar Wei
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding