APPARATUS FOR MOUNTING A SEMICONDUCTOR CHIP AND MAKING ELECTRICAL CONNECTIONS THERETO
NARAYAN, JAGDISH, OSBURN, CARLTON M, REISMAN, ARNOLD, HWANG, LIH-TYNG
Year of Publication 01.03.1989
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Year of Publication 01.03.1989
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APPARATUS FOR MOUNTING A SEMICONDUCTOR CHIP AND MAKING ELECTRICAL CONNECTIONS THERETO
NARAYAN, JAGDISH, OSBURN, CARLTON M, REISMAN, ARNOLD, HWANG, LIH-TYNG
Year of Publication 21.02.1989
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Year of Publication 21.02.1989
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Apparatus for mounting a semiconductor chip and making electrical connections thereto
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Year of Publication 27.09.1988
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Year of Publication 27.09.1988
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Apparatus for mounting a semiconductor chip and making electrical connections thereto
NARAYAN, JAGDISH, OSBURN, CARLTON M, REISMAN, ARNOLD, HWANG, LIH-TYNG
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Year of Publication 15.04.1987
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HIGH PERFORMANCE INTEGRATED CIRCUIT CHIP PACKAGE AND METHOD OF MAKING SAME
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Year of Publication 30.03.1999
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High performance integrated circuit chip package
TURLIK; IWONA, REISMAN; ARNOLD, NAYAK; DEEPAK, HWANG; LIH-TYNG, DARVEAUX; ROBERT F, JACOBS; SCOTT L, DISHON; GIORA, POLEY; NEIL M
Year of Publication 28.06.1994
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Year of Publication 28.06.1994
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HIGH PERFORMANCE INTEGRATED CIRCUIT CHIP PACKAGE AND METHOD OF MAKING SAME
JACOBS, SCOTT L, DISHON, GIORA, DARVEAUX, ROBERT FRANCIS, REISMAN, ARNOLD, POLEY, NEIL M, HWANG, LIH-TYNG, NAYAK, DEEPAK, TURLIK, IWONA
Year of Publication 06.11.1991
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Year of Publication 06.11.1991
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High performance integrated circuit chip package and method of making same
JACOBS, SCOTT L, DISHON, GIORA, DARVEAUX, ROBERT FRANCIS, REISMAN, ARNOLD, POLEY, NEIL M, HWANG, LIH-TYNG, NAYAK, DEEPAK, TURLIK, IWONA
Year of Publication 16.05.1990
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Year of Publication 16.05.1990
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High Performance Integrated Circuit Chip Package and Method of Making Same
JACOBS, SCOTT L, DISHON, GIORA, DARVEAUX, ROBERT F, REISMAN, ARNOLD, POLEY, NEIL M, HWANG, LIH-TYNG, NAYAK, DEEPAK, TURLIK, IWONA
Year of Publication 10.05.1990
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Year of Publication 10.05.1990
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