Fabrication of Cu nano particles by direct electrochemical reduction from CuO nano particles
Han, Won-Kyu, Choi, Jae-Woong, Hwang, Gil-Ho, Hong, Seok-Jun, Lee, Jai-Sung, Kang, Sung-Goon
Published in Applied surface science (15.02.2006)
Published in Applied surface science (15.02.2006)
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Journal Article
Determination of trace amounts of lead and cadmium using a bismuth/glassy carbon composite electrode
Hwang, Gil-Ho, Han, Won-Kyu, Hong, Seok-Jun, Park, Joon-Shik, Kang, Sung-Goon
Published in Talanta (Oxford) (15.02.2009)
Published in Talanta (Oxford) (15.02.2009)
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Journal Article
Bismuth/Glassy Carbon Composite Electrode for the Determination of Trace Lead and Cadmium
Hwang, Gil-Ho, Hong, Seok-Jun, Han, Won-kyu, Park, Joon-Shik, Kang, Sung-Goon
Published in ECS transactions (03.10.2008)
Published in ECS transactions (03.10.2008)
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Journal Article
Determination of trace metals by anodic stripping voltammetry using a bismuth-modified carbon nanotube electrode
Hwang, Gil Ho, Han, Won Kyu, Park, Joon Shik, Kang, Sung Goon
Published in Talanta (Oxford) (15.07.2008)
Published in Talanta (Oxford) (15.07.2008)
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Journal Article
Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer
Han, Won-Kyu, Hwang, Gil-Ho, Hong, Seok-Jun, Kim, Soo-Seok, Yoon, Chong-Seung, Kwak, Noh-Jung, Yeom, Seung-Jin, Kim, Jae-Hong, Kang, Sung-Goon
Published in Microelectronic engineering (01.03.2009)
Published in Microelectronic engineering (01.03.2009)
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Journal Article
Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO 2 substrate by a self-assembled-monolayer (SAM) process
Han, Won-Kyu, Hwang, Gil-Ho, Hong, Seok-Jun, Yoon, Chong-Seung, Park, Joon-Shik, Cho, Jin-Ki, Kang, Sung-Goon
Published in Applied surface science (01.04.2009)
Published in Applied surface science (01.04.2009)
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Journal Article
Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process
HAN, Won-Kyu, HWANG, Gil-Ho, HONG, Seok-Jun, YOON, Chong-Seung, PARK, Joon-Shik, CHO, Jin-Ki, KANG, Sung-Goon
Published in Applied surface science (01.04.2009)
Published in Applied surface science (01.04.2009)
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Journal Article
An electrochemical preparation of bismuth nanoparticles by reduction of bismuth oxide nanoparticles and their application as an environmental sensor
Gil Ho Hwang, Won Kyu Han, So Jin Kim, Joon Shik Park, Hyun Joon Park, Seok Jun Hong, Sung Goon Kang
Published in Journal of Ceramic Processing Research, 10(2) (01.04.2009)
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Published in Journal of Ceramic Processing Research, 10(2) (01.04.2009)
Journal Article
Phase transformation of Ni–B, Ni–P diffusion barrier deposited electrolessly on Cu interconnect
Choi, Jae Woong, Hwang, Gil Ho, Han, Won Kyu, Kang, Sung Goon
Published in Applied surface science (15.12.2006)
Published in Applied surface science (15.12.2006)
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Journal Article
Relationship Between Wafer-Level Warpage and Cu Overburden Thickness Controlled by Isotropic Wet Etching for Through Si Vias
Jae Woong Choi, Lee Guan Ong, Hong Yu Li, Soon Wook Kim, Hwang, Gil Ho, Jang, Steven Lee Hou, Murthy, Ramana, Kiat, Eugene Tan Swee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)
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Journal Article
Accelerated Publication: Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer
Han, Won-Kyu, Hwang, Gil-Ho, Hong, Seok-Jun, Kim, Soo-Seok, Yoon, Chong-Seung, Kwak, Noh-Jung, Yeom, Seung-Jin, Kim, Jae-Hong, Kang, Sung-Goon
Published in Microelectronic engineering (01.03.2009)
Published in Microelectronic engineering (01.03.2009)
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Journal Article
Effect of Cu on the surface hardness of Ni−B coating for the strengthening of the Cu surface
Choi, Jae Woong, Hwang, Gil Ho, Han, Won Kyu, Lee, Wan Hee, Kang, Sung Goon
Published in Metals and materials international (01.10.2007)
Published in Metals and materials international (01.10.2007)
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Journal Article
Fabrication of a probe needle using a tubular cathode by electrochemical etching
Choi, Jae Wong, Hwang, Gil Ho, Kang, Sung Goon
Published in Metals and materials international (01.02.2006)
Published in Metals and materials international (01.02.2006)
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Journal Article
Electroless Cu Deposition on 41nm Trench-Pattern SiO2 substrate for ULSI Interconnects by Means of a Self-Assembled-Monolayer (SAM) Process
Han, Won-kyu, Ju, Jeong-woon, Ko, Yong-nam, Kang, Sunggoon, Hwang, Gil-Ho
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
Published in Meeting abstracts (Electrochemical Society) (29.08.2008)
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Journal Article