Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
Li, J.F., Mannan, S.H., Clode, M.P., Whalley, D.C., Hutt, D.A.
Published in Acta materialia (01.06.2006)
Published in Acta materialia (01.06.2006)
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Journal Article
Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics
Webb, D.P., Hutt, D.A., Hopkinson, N., Conway, P.P., Palmer, P.J.
Published in Journal of microelectromechanical systems (01.04.2009)
Published in Journal of microelectromechanical systems (01.04.2009)
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Journal Article
Fluxless Soldering of Copper Substrates Using Self-Assembled Monolayers for Preservation
Changqing Liu, Hutt, D.A.
Published in IEEE transactions on components and packaging technologies (01.09.2006)
Published in IEEE transactions on components and packaging technologies (01.09.2006)
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Journal Article
Packaging Effects on MEMS Pressure Sensor Hysteresis
Hamid, Y., Hutt, D.A., Whalley, D.C., Craddock, R.
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects
Jianfeng Li, Mannan, S.H., Clode, M.P., Liu, C., Chen, K., Whalley, D.C., Hutt, D.A., Conway, P.P.
Published in IEEE transactions on components and packaging technologies (01.09.2008)
Published in IEEE transactions on components and packaging technologies (01.09.2008)
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Journal Article
Electroless nickel bumping of aluminum bondpads. II. Electroless nickel plating
Hutt, D.A., Liu, C., Conway, P.P., Whalley, D.C., Mannan, S.H.
Published in IEEE transactions on components and packaging technologies (01.03.2002)
Published in IEEE transactions on components and packaging technologies (01.03.2002)
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Journal Article
Dispersion and microwave processing of nano-sized ITO powder for the fabrication of transparent conductive oxides
Ghanizadeh, S., Peiris, T.A. Nirmal, Jayathilake, D.S.Y., Hutt, D.A., Wijayantha, K.G.U., Southee, D.J., Conway, P.P., Marchand, P., Darr, J.A., Parkin, I.P., Carmalt, C.J.
Published in Ceramics international (01.12.2016)
Published in Ceramics international (01.12.2016)
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Journal Article
Indium tin oxide nanowires manufactured via printing and laser irradiation
McGhee, J.R., Goulas, A., Southee, D.J., Sagu, J.S., Engstrøm, D.S., Wang, J., Hutt, D.A., Evans, P.S.A., Zhou, Z., Wijayantha, K.G.U., Conway, P., Carmalt, C.J.
Published in Applied materials today (01.12.2020)
Published in Applied materials today (01.12.2020)
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Journal Article
Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly
Firmstone, M.G, Bartholomew, P.M, Lowrie, D.J.J, Mannan, S.H, Hutt, D.A
Published in Soldering & surface mount technology (01.04.1999)
Published in Soldering & surface mount technology (01.04.1999)
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Journal Article
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
Li, J.F., Mannan, S.H., Clode, M.P., Chen, K., Whalley, D.C., Liu, C., Hutt, D.A.
Published in Acta materialia (2007)
Published in Acta materialia (2007)
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Journal Article
A comparative study of the interfacial reaction between electroless Ni–P coatings and molten tin
Chen, K., Liu, C., Whalley, D.C., Hutt, D.A., Li, J.F., Mannan, S.H.
Published in Acta materialia (01.11.2008)
Published in Acta materialia (01.11.2008)
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Journal Article
Failure Mechanisms of Dummy IGBT Assembles Constructed using Liquid In-Sn/Nb System
Jianfeng Li, Sarvar, F., Whalley, D.C., Hutt, D.A., Clode, M.P., Mannan, S.H.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Scanning acoustic microscopy investigation of engineered flip-chip delamination
Hutt, D.A., Webb, D.P., Hung, K.C., Tang, C.W., Conway, P.P., Whalley, D.C., Chan, Y.C.
Published in Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) (2000)
Published in Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146) (2000)
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Conference Proceeding
Evaluation of predeposited noflow underfill for flip chip and CSP assembly
Firmstone, M.G., Bartholomew, P.M., Lowrie, D.J.J., Mannan, S.H., Hutt, D.A.
Published in Soldering & surface mount technology (01.04.1999)
Published in Soldering & surface mount technology (01.04.1999)
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Journal Article
The blue photoluminescence and nanostructure of Si and C clusters embedded in SiO2 matrices
Zhang, Q., Bayliss, S.C., Al-Ajili, A., Hutt, D.A., Harris, P.
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (02.05.1995)
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (02.05.1995)
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Journal Article
Variation in the line stability of an inkjet printed optical waveguide-applicable material
Chappell, J., Hutt, D.A., Conway, P.P.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding