Simulation of Solidification Process of BGA Tin-Lead Solder ball Based on Cellular Automaton Method
Li, Xiang, Gao, Tianming, Guo, Shuhan, Li, Yang, Huo, Shixing, Wang, Hengrui, Li, Shuai, Zhang, Tao, Li, Shu
Published in Journal of physics. Conference series (01.09.2020)
Published in Journal of physics. Conference series (01.09.2020)
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