Effects of Milling and Other Repairs on Smoothness of Overlays on Asphalt Pavements
Hung, Shawn S., Rezaei, Arash, Harvey, John T.
Published in Transportation research record (01.01.2014)
Published in Transportation research record (01.01.2014)
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Journal Article
System technology co-optimization and design challenges for 3D IC
Jeloka, Supreet, Cline, Brian, Das, Shidhartha, Labbe, Benoit, Rico, Alejandro, Herberholz, Rainer, DeLaCruz, Javier, Mathur, Rahul, Hung, Shawn
Published in 2022 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2022)
Published in 2022 IEEE Custom Integrated Circuits Conference (CICC) (01.04.2022)
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Conference Proceeding
Applying IEEE Std 1838 to the 3DIC Design Trishul - A Case Study
McLaurin, Teresa, Frederick, Frank, Perry, Heath, Hung, Shawn, Sinha, Saurabh
Published in 2021 IEEE European Test Symposium (ETS) (24.05.2021)
Published in 2021 IEEE European Test Symposium (ETS) (24.05.2021)
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Conference Proceeding
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
Mathur, Rahul, Chao, Chien-Ju, Liu, Rossana, Tadepalli, Nikhil, Chandupatla, Pranavi, Hung, Shawn, Xu, Xiaoqing, Sinha, Saurabh, Kulkarni, Jaydeep
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
Mathur, Rahul, Chien-Ju, Chao, Liu, Rossana, Tadepalli, Nikhil, Chandupatla, Pranavi, Hung, Shawn, Xu, Xiaoqing, Sinha, Saurabh, Kulkarni, Jaydeep
Published in arXiv.org (31.07.2020)
Published in arXiv.org (31.07.2020)
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Paper
Journal Article
Development of Performance-Based Specifications for Asphalt Rubber Binder: Interim Report on Phase 1 and Phase 2 Testing
Jones, David, Rizvi, Hashim Raza, Liang, Yanlong, Hung, Shawn, Buscheck, Jeffrey, Alavi, Mohammad Zia, Hofko, Bernhard
Published in IDEAS Working Paper Series from RePEc (01.01.2020)
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Published in IDEAS Working Paper Series from RePEc (01.01.2020)
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