A new thermally conductive thermoplastic die attach film
Yajun Duan, Lilei Ye, Huiwang Cui, Johan Liu
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Study into high temperature reliability of isotropic conductive adhesive
Wenhui Du, Huiwang Cui, Si Chen, Zhichao Yuan, Lilei Ye, Liu, J.
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
Effects of BN and SiC nanoparticles on properties of conductive adhesive
Huaxiang Lai, Xiuzhen Lu, Huiwang Cui, Xiaohua Liu, Si Chen, Tianan Chen, Liu, Johan
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
The effect of functionalized silver on properties of conductive adhesives
Qiong Fan, Huiwang Cui, Dongsheng Li, Zhili Hu, Zhichao Yuan, Lilei Ye, Johan Liu
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
Study into the application of single-wall carbon nanotubes in isotropic conductive adhesives
Dongsheng Li, Huiwang Cui, Qiong Fan, Yajun Duan, Zhichao Yuan, Lilei Ye, Johan Liu
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
New fast curing isotropic conductive adhesive for electronic packaging application
Wenhui Du, Chune Fu, Si Chen, Huiwang Cui, Xiaohua Liu, Tianan Chen, Liu, Johan
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
Reliability characterisation of Bi-modal high temperature stable Isotropic Conductive Adhesives
Wenkai Tao, Si Chen, Xiaohua Liu, Huiwang Cui, Tianan Chen, Liu, Johan
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability
Li, Dongsheng, Cui, Huiwang, Chen, Si, Fan, Qiong, Yuan, Zhichao, Ye, Lilei, Liu, Johan
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Study on the Reliability of Fast Curing Isotropic Conductive Adhesive
Du, Wenhui, Cui, Huiwang, Chen, Si, Yuan, Zhichao, Ye, Lilei, Liu, Johan
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives
Fan, Qiong, Cui, Huiwang, Fu, Chune, Li, Dongsheng, Tang, Xin, Yuan, Zhichao, Ye, Lilei, Liu, Johan
Published in ECS Transactions (01.01.2011)
Published in ECS Transactions (01.01.2011)
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Journal Article
Conference Proceeding