The Influence of Leveler on the Impurity Behavior of Electroplated Cu Films During Laser Annealing
Tan, Lingyue, Han, Silin, Chen, Shuhui, Hang, Tao, Ling, Huiqin, Wu, Yunwen, Li, Ming
Published in Journal of the Electrochemical Society (01.06.2021)
Published in Journal of the Electrochemical Society (01.06.2021)
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Journal Article
Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodeposition
Hang, Tao, Hu, Anmin, Ling, Huiqin, Li, Ming, Mao, Dali
Published in Applied surface science (01.02.2010)
Published in Applied surface science (01.02.2010)
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Journal Article
Effects of W contents on the solid-state interfacial reactions of Sn/Co-W
Chen, Shuhui, Yang, Chenlin, Tan, Lingyue, Xia, Yuanyuan, Hu, Anmin, Ling, Huiqin, Wu, Yunwen, Li, Ming, Hang, Tao
Published in Journal of materials science (2022)
Published in Journal of materials science (2022)
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Journal Article
Growth behavior of tin whisker on SnAg microbump under compressive stress
Sun, Menglong, Dong, Mengya, Wang, Dongfan, Ling, Huiqin, Hu, An-min, Li, Ming
Published in Scripta materialia (01.04.2018)
Published in Scripta materialia (01.04.2018)
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Journal Article
Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps
Yang, Chenlin, Ren, Siru, Zhang, Xundi, Hu, Anmin, Li, Ming, Gao, Liming, Ling, Huiqin, Hang, Tao
Published in Materials characterization (01.01.2020)
Published in Materials characterization (01.01.2020)
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Journal Article
Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology
Sun, Yaqian, Wang, Jing, Zhang, Xundi, Yang, Chenlin, Hu, Anmin, Hang, Tao, Wu, Yunwen, Ling, Huiqin, Li, Ming
Published in Electronic materials letters (01.11.2021)
Published in Electronic materials letters (01.11.2021)
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Journal Article
Linear Sweep Voltammetric Study on the Copper Electrodeposition of Though-Silicon-Vias
Cao, Haiyong, Hang, Tao, Ling, Huiqin, Gao, Liming, Li, Ming
Published in Journal of the Electrochemical Society (01.01.2014)
Published in Journal of the Electrochemical Society (01.01.2014)
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Journal Article
Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing
Zhang, Xundi, Yang, Chenlin, Zhang, Yumei, Hu, Anmin, Li, Ming, Gao, Liming, Ling, Huiqin, Hang, Tao
Published in Electronic materials letters (01.07.2020)
Published in Electronic materials letters (01.07.2020)
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Journal Article
Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps
Ren, Siru, Sun, Menglong, Jin, Zebin, Guo, Yukun, Ling, Huiqin, Hu, An-min, Li, Ming
Published in Electronic materials letters (01.09.2019)
Published in Electronic materials letters (01.09.2019)
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Journal Article
Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage
Lin, Ke, Wang, Jing, Yang, Chenlin, Sun, Menglong, Hu, Anmin, Wu, Yunwen, Ling, Huiqin, Li, Ming
Published in Materials letters. X (01.03.2021)
Published in Materials letters. X (01.03.2021)
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Journal Article
Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distribution
Cao, Haiyong, Hang, Tao, Ling, Huiqin, Luo, Wei, Feng, Xue, Li, Ming
Published in Microelectronic engineering (25.03.2014)
Published in Microelectronic engineering (25.03.2014)
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Journal Article
Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositing
Bi, Jinglin, Ling, Huiqin, Hu, Anmin, Hang, Tao, Li, Ming
Published in Applied surface science (01.02.2011)
Published in Applied surface science (01.02.2011)
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Journal Article
Preparation of nanocrystals hydroxyapatite/TiO2 compound by hydrothermal treatment
Anmin, Hu, Tong, Lei, Ming, Li, Chengkang, Chang, Huiqin, Ling, Dali, Mao
Published in Applied catalysis. B, Environmental (22.03.2006)
Published in Applied catalysis. B, Environmental (22.03.2006)
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Journal Article