Search Results - "Hugo, Stephen M" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Laminate bond strength detection

Laminate bond strength detection

by Lewis, Theron L, Hugo, Stephen M
Year of Publication 11.09.2018

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Patent

Method of making integrated die paddle structures for bottom terminated components

Method of making integrated die paddle structures for bottom terminated components

by Hugo, Stephen M, Jeanson, Mark J, Kelly, Matthew S
Year of Publication 09.06.2020

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Patent

Increasing solder hole-fill in a printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

by Hugo, Stephen M, Kelly, Matthew S
Year of Publication 29.05.2018

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Patent

Integrated die paddle structures for bottom terminated components

Integrated die paddle structures for bottom terminated components

by Hugo, Stephen M, Jeanson, Mark J, Kelly, Matthew S
Year of Publication 11.02.2020

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Patent

Laminate bond strength detection

Laminate bond strength detection

by Hugo Stephen M, Lewis Theron L
Year of Publication 06.03.2018

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Patent

LAMINATE BOND STRENGTH DETECTION

LAMINATE BOND STRENGTH DETECTION

by Hugo Stephen M, Lewis Theron L
Year of Publication 15.02.2018

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Patent

LAMINATE BOND STRENGTH DETECTION

LAMINATE BOND STRENGTH DETECTION

by Hugo Stephen M, Lewis Theron L
Year of Publication 06.07.2017

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Patent

Increasing solder hole-fill in a printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

by Kelly Matthew S, Hugo Stephen M
Year of Publication 30.05.2017

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Patent

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

by Kelly Matthew S, HUGO STEPHEN M
Year of Publication 18.05.2017

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Patent

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

by Hugo, Stephen M, Jeanson, Mark J, Kelly, Matthew S
Year of Publication 18.10.2018

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Patent

Integrated die paddle structures for bottom terminated components

Integrated die paddle structures for bottom terminated components

by Hugo, Stephen M, Jeanson, Mark J, Kelly, Matthew S
Year of Publication 25.09.2018

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Patent

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

by Kelly Matthew S, Hugo Stephen M
Year of Publication 13.10.2016

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Patent

Increasing solder hole-fill in a printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

by Kelly Matthew S, Hugo Stephen M
Year of Publication 30.08.2016

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Patent

Detecting and correcting deficiencies in surface conditions for bonding applications

Detecting and correcting deficiencies in surface conditions for bonding applications

by Bielick, James D, Lewis, Theron L, Bartsch, Timothy A, Dangler, John R, Hugo, Stephen M, Bennett, Jennifer, Braun, David J, Younger, Timothy P
Year of Publication 08.03.2022

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Patent

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

by Jeanson Mark J, Kelly Matthew S, Hugo Stephen M
Year of Publication 22.02.2018

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Patent

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

by KELLY MATTHEW S, HUGO STEPHEN M
Year of Publication 11.02.2016

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Patent

Heat transfer device for wave soldering

Heat transfer device for wave soldering

by KELLY MATTHEW S, HUGO STEPHEN M
Year of Publication 05.01.2016

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Patent

Heat transfer device for wave soldering

Heat transfer device for wave soldering

by KELLY MATTHEW S, HUGO STEPHEN M
Year of Publication 29.09.2015

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Patent

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

by Jeanson Mark J, Kelly Matthew S, Hugo Stephen M
Year of Publication 22.06.2017

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Patent

Electromagnetic shielding of heat sinks with shape-memory alloy grounding

Electromagnetic shielding of heat sinks with shape-memory alloy grounding

by Bielick, James D, Lewis, Theron L, Dangler, John R, Hugo, Stephen M, Bennett, Jennifer, Younger, Timothy P, Braun, David J
Year of Publication 25.02.2020

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Patent