BEOL Interconnect Innovation: Materials, Process and Systems Co-optimization for 3nm Node and Beyond
Thareja, Gaurav, Pal, Ashish, Wang, Xingye, Dag, Sefa, You, Shi, Sharma, Shashank, Zhu, Qing, Cervantes, Carmen L., Hwang, Shinjae, Spuller, Matthew, Ng, Ben, Kumar, Pradeep S., Tam, Norman, Gage, Max, Deshpande, Sameer, Wu, Zhiyuan, Jansen, Alexander, Dey, Liton, Chen, Feng, Xie, Xianjin, Kashefizadeh, Keyvan, Reddy, Vinod, Lo, Andy, Chen, Zhebo, Huey, Sidney, Tang, Jianshe, Ren, He, Naik, Mehul, Brown, Brian, Kesapragada, Sree, Sangamali, Buvna Ayyagari, Bazizi, El Mehdi, Tang, Xianmin
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
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Conference Proceeding
CMP Process Control for Advanced CMOS Device Integration
Huey, Sidney, Chandrasekaran, Balaji, Bennett, Doyle, Tsai, Stan, Xu, Kun, Qian, Jun, Dhandapani, Siva, David, Jeff, Swedek, Bogdan, Karuppiah, Lakshmanan
Published in ECS transactions (16.03.2012)
Published in ECS transactions (16.03.2012)
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Journal Article
POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION
LEUNG GARLEN C, SEKINE TAKETO, HUEY SIDNEY P, DAVID JEFFREY DRUE, KITAJIMA TOMOHIKO, QIAN JUN
Year of Publication 20.03.2017
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Year of Publication 20.03.2017
Patent
Impact of Film Morphology on Chemical Mechanical Polishing of Tungsten
Xu, Kun, Shen, Shih-Haur, Fung, Jason, Iravani, Hassan, Carlsson, Ingemar, Liu, Tzu-Yu, Swedek, Bogdan, Chang, Shou-Sung, Tu, Wen-chiang, Kitajima, Tomohiko, Mikhaylich, Katrina, Brown, Brian, Huey, Sidney, Redeker, Fritz
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
Tungsten Interconnect Resistance Reduction Enabling Energy Efficient and High Performance Applications for 2nm Node and Beyond
Thareja, Gaurav, Pal, Ashish, Ma, Quan, Ching, Chi, Patel, Sahil, Gao, Xingyao, Dag, Sefa, Qi, Zhimin, Zhang, Aixi, Yue, Shiyu, Lei, Wei, Xu, Yi, Lei, Yu, Jiang, Hao, You, Shi, Zheng, Wenkai, Hung, Raymond, Costrini, Gregory, Zhu, Qing, Tran, Randy, Gupta, Rohit, Reddy, Vinod, Vyas, Pratik B., Hassan, Sajjad, Cai, Man Ping, Shen, Gang, Chen, Zhebo, Hou, Wenting, Lei, Jianxin, Wang, Rongjun, Shen, Walters, Deshpande, Sameer, Huey, Sidney, Tang, Jianshe, Naik, Mehul, Kesapragada, Sree, Ayyagari-Sangamali, Buvna, Bazizi, El Mehdi, Tang, Xianmin
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)
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Conference Proceeding
MOL Local Interconnect Innovation: Materials, Process & Systems Co-optimization for 3nm Node and Beyond
Pal, Ashish, Thareja, Gaurav, Dag, Sefa, Costrini, Gregory, Reddy, Vinod, Xu, Yi, Lei, Yu, Zhang, Aixi, Shen, Gang, Jansen, Alexander, Chen, Zhebo, Gage, Max, Tang, Jianshe, Yang, Yen-Chu, Deshpande, Sameer, Huey, Sidney, Hung, Raymond, Jiang, Hao, Cai, Man-Ping, Abramovitz, Yaniv, Engel, Lior, Naik, Mehul, Wang, Rongjun, Kesapragada, Sree, Ayyagari-Sangamalli, Buvna, Tang, Xianmin, Bazizi, El Mehdi
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
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Conference Proceeding
PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU PAD CONDITIONING
CHOU, Chih Chung, TANG, Jianshe, HUEY, Sidney, POLLARD, Chad, OH, Jeonghoon, CHEN, Hui, CHANG, Shou-Sung, DESHPANDE, Sameer, WU, Haosheng
Year of Publication 29.02.2024
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Year of Publication 29.02.2024
Patent