How to improve void performance in wafer bumping
Zhang Ruifen, Yap Kong Tat, Yam Lip Huei, Dexter, Reynoso
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Ultra-fine SAC305 Solder Paste Interconnection Solution for Advanced Packaging
Jason, Lim Chze Min, Kumar, B. Senthil, Sungsig, Kang, Huei, Yam Lip, Fen, Zhang Rui, Murali, Sarangapani
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19.10.2022)
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19.10.2022)
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Conference Proceeding
The Impact of Environment Humidity on WS Paste Characteristics
Fen, Zhang Rui, Jason, Lim Chze Min, Huei, Yam Lip, Kumar, Balasubramanian Senthil, Murali, Sarangapani, Wen, Zhang Han, Sungsig, SS Kang, Li-San, Chan
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Solder Paste Transfer Via Pattern Tape Technology
Huei, Yam Lip, Ting, Lo Yee, Hui, Chong Kim, Kumar, B. Senthil, Li-San, Chan, Fritzsche, Sebastian
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)
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Conference Proceeding
Characterization of Coating on Fine Interconnect Materials
Huei, Yam Lip, Murali, Sarangapani, Agala, Joel, Wan, Lo Miew, Jason, Wong Chin Yeung
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
MANUFACTURING AND TAPE TRANSFER METHOD FOR A PATTERNED PREFORM
MAO, YanDa, LO, Yee Ting, BALASUBRAMANIAN, Senthil Kumar, AGALA, Joel, SARANGAPANI, Murali, WONG, Chin Yeung, YAM, Lip Huei, PAN, Wei Chih
Year of Publication 24.07.2024
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Year of Publication 24.07.2024
Patent
MANUFACTURING AND TAPE TRANSFER METHOD FOR A PATTERNED PREFORM
MAO, YanDa, LO, Yee Ting, BALASUBRAMANIAN, Senthil Kumar, AGALA, Joel, WONG, Dr. Chin Yeung, SARANGAPANI, Murali, YAM, Lip Huei, PAN, Wei Chih
Year of Publication 22.04.2021
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Year of Publication 22.04.2021
Patent
MANUFACTURING AND TAPE TRANSFER METHOD FOR A PATTEERNED PREFORM
MAO, YanDa, LO, Yee Ting, BALASUBRAMANIAN, Senthil Kumar, AGALA, Joel, SARANGAPANI, Murali, WONG, Chin Yeung, YAM, Lip Huei, PAN, Wei Chih
Year of Publication 21.04.2021
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Year of Publication 21.04.2021
Patent
Manufacturing and tape transfer method for a patterned preform
WONG, CHIN YEUNG, YAM, LIP HUEI, PAN, WEI CHIH, MAO, YAN-DA, BALASUBRAMANIAN, SENTHIL KUMAR, AGALA, JOEL, SARANGAPANI, MURALI, LO, YEE TING
Year of Publication 16.08.2021
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Year of Publication 16.08.2021
Patent