Enhancing Productivity for IC-substrate manufacturing by using a novel Copper Electrolyte for Semi Additive Plating
Ferro, Angelo, Ozkok, Mustafa, Huebner, Henning, Fujiwara, Toshiya
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
Adjustable EMI Shielding on Electronic Packages Realized by Electrolytic Plating
Ozkok, Mustafa, Lamprecht, Sven, Klusmann, Eckart, Hubner, Henning
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
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Conference Proceeding
Next Generation Plating Technologies for FO-Panel Level Packaging
Zoberbier, Ralph, Welsh, James, Ohde, Christian, Huebner, Henning
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
Ozkok, Mustafa, Lamprecht, Sven, Ozkok, Akif, Chien, Simon, Hubner, Henning, Ohde, Christian
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding
Advanced via filling for improved within-unit distribution
Hubner, Henning, Kenny, Stephen, Mann, Olivier
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
Published in 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2013)
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Conference Proceeding