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Published in IEEE journal of quantum electronics (01.06.2024)
Published in IEEE journal of quantum electronics (01.06.2024)
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Liquid Phase Deposition of Hafnium Oxide Thin Films
Zhu, Xuanyu, Zhang, Kaixin, Sun, Jie, Lin, Chang, Pan, Kui, Yang, Tianxi, Huang, Zhonghang, Deng, Liying, Yan, Ziwen, Liu, Yifeng, Nie, Junyang, Yan, Qun
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Published in IEEE transactions on dielectrics and electrical insulation (01.08.2024)
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Highly effective transfer of micro-LED pixels to the intermediate and rigid substrate with weak and tunable adhesion by thiol modification
Pan, Kui, Sun, Jie, Lin, Chang, Deng, Liying, Li, Xiao, Mao, Zuodong, Yang, Tianxi, Huang, Zhonghang, Li, Yang, Nie, Junyang, Guo, Tailiang, Yan, Qun
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Published in Nanoscale (02.03.2023)
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Electroless deposition of nickel microbumps for fine-pith flip-chip bonding
Lu, Yu, Lin, Chang, Wang, Shuaishuai, Zhang, Kaixin, Lang, Taifu, Li, Yang, Li, Qiwei, Yang, Tianxi, Huang, Zhonghang, Yan, Chunli, Sun, Jie, Yan, Qun
Published in 2023 4th International Conference on Material Chemistry and Composite Materials, MCCM 2023, Sanya, China (01.06.2024)
Published in 2023 4th International Conference on Material Chemistry and Composite Materials, MCCM 2023, Sanya, China (01.06.2024)
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Conference Proceeding
Electroless deposition of high-uniformity nickel microbumps with ultrahigh resolution of 8 μm pitch for monolithic Micro-LED display
Lu, Yu, Lin, Chang, Tian, Liang, Wang, Shuaishuai, Zhang, Kaixin, Lang, Taifu, Li, Yang, Li, Qiwei, Yang, Tianxi, Huang, Zhonghang, Sun, Jie, Yan, Qun
Published in Materials science in semiconductor processing (01.06.2024)
Published in Materials science in semiconductor processing (01.06.2024)
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Passive matrix Micro-LED display driven by STM32 microcontroller using a two-wire serial transmission method
Chen, Shaohang, He, Shuang, He, Jun, Zhang, Zhi, Xia, Zhiming, Huang, Zhonghang, Zhang, Kaixin, Lin, Chang, Su, Anjun, Chen, Nianrui, Zhou, Jun, Yan, Qun, Sun, Jie
Published in Journal of physics. Conference series (01.06.2023)
Published in Journal of physics. Conference series (01.06.2023)
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Electroless Deposition of 4 μm High Ni/Au Bumps for 8 μm Pitch Interconnection
Tian, Liang, Lin, Chang, Pan, Kui, Lu, Yu, Deng, Liying, Huang, Zhonghang, Yang, Tianxi, Zhang, Yongai, Sun, Jie, Yan, Qun
Published in ACS applied electronic materials (25.10.2022)
Published in ACS applied electronic materials (25.10.2022)
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