Robust TiN HM process to overcome under etch issue for SAV scheme on 14nm node
Tzu-Hao Fu, Yuan-Fu Ke, Shih-Chun Tsai, Chun-Ling Lin, Kuo-Wei Chen, Ming-Yung Huang, Cho, Gary, San-Fu Lin, Ting-Jun Wang, Cheng, Albert
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
Published in 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) (01.05.2015)
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Conference Proceeding
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Tseng, Chin-An, Cheng, Mien-Mien, Huang, Yung-Ming, Chen, Yi-Ching, Hung, Wen-Chang
Year of Publication 17.03.2020
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Year of Publication 17.03.2020
Patent