A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications
Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Yang, Yu-Tao, Hung, Tzu-Heng, Chen, Kuan-Neng
Published in IEEE electron device letters (01.03.2024)
Published in IEEE electron device letters (01.03.2024)
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Journal Article
Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications
Huang, Yuan-Chiu, Hu, Han-Wen, Liu, Yun-Hsi, Hsieh, Hui-Ching, Chen, Kuan-Neng
Published in IEEE journal of the Electron Devices Society (2024)
Published in IEEE journal of the Electron Devices Society (2024)
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Journal Article
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
Huang, Yuan-Chiu, Lin, Yu-Xian, Hsiung, Chien-Kang, Hung, Tzu-Heng, Chen, Kuan-Neng
Published in Nanomaterials (Basel, Switzerland) (01.09.2023)
Published in Nanomaterials (Basel, Switzerland) (01.09.2023)
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Journal Article
Low Temperature Cu-Cu Bonding with Electroless Deposited Metal Passivation for Fine-Pitch 3D Packaging
Huang, Yuan-Chiu, Liu, Demin, Hsiung, Kuma, Chou, Tzu-Chieh, Hu, Han-Wen, Sundarrajan, Arvind, Chang, Hsin Chi, Pan, Yi-Yu, Weng, Ming-Wei, Chen, Kuan-Neng
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Dual-frequency bistable liquid crystal display and the liquid crystal mixture thereof
WANG XIN-JIU, HUANG CHIU-YUAN, CHEN YEN-LIANG, CHEN CHIA-HUI, WANG SHYH-YUEH
Year of Publication 15.12.2015
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Year of Publication 15.12.2015
Patent
Dual-Frequency Bistable Liquid Crystal Display And The Liquid Crystal Mixture Thereof
WANG XIN-JIU, HUANG CHIU-YUAN, CHEN YEN-LIANG, CHEN CHIA-HUI, WANG SHYH-YUEH
Year of Publication 14.05.2015
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Year of Publication 14.05.2015
Patent